Method and apparatus for performing limited area spectral analysis
First Claim
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1. A method of monitoring a substrate in a semiconductor substrate processing chamber, comprising:
- acquiring data at a first location on a substrate disposed in a semiconductor substrate processing chamber using an in-situ measuring tool disposed therein, the measuring tool moveable along two axes;
moving the measuring tool to at least a second location over the substrate; and
acquiring data at at least a second location on the substrate.
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Abstract
A method and apparatus for obtaining in-situ data of a substrate in a semiconductor substrate processing chamber is provided. The apparatus includes an optics assembly for acquiring data regarding a substrate and an actuator assembly adapted to laterally move the optics assembly in two dimensions relative to the substrate.
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Citations
20 Claims
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1. A method of monitoring a substrate in a semiconductor substrate processing chamber, comprising:
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acquiring data at a first location on a substrate disposed in a semiconductor substrate processing chamber using an in-situ measuring tool disposed therein, the measuring tool moveable along two axes; moving the measuring tool to at least a second location over the substrate; and acquiring data at at least a second location on the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of monitoring a substrate in a semiconductor substrate processing chamber, comprising:
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providing an etch chamber having an in-situ measuring tool disposed therein, the measuring tool moveable along two axes; acquiring data at a first location on a substrate disposed in the etch chamber using the measuring tool; moving the measuring tool to at least a second location over the substrate; and acquiring data at least a second location on the substrate. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification