Implantable microstimulator with conductive plastic electrode and methods of manufacture and use

• US 7,330,756 B2
• Filed: 03/18/2005
• Issued: 02/12/2008
• Est. Priority Date: 03/18/2005
• Status: Expired due to Fees

• Current Assignee: Boston Scientific Neuromodulation Corporation (Boston Scientific Corporation)
• Original Assignee: Advanced Bionics Corporation (Sonova Holding AG)
• Inventors: Marnfeldt, Goran Nils
• Primary Examiner(s): Schaetzle; Kennedy J.
• Assistant Examiner(s): LEE, YUN H
• Application Number:
  US11/084,368
• Publication Number:
  US 20060212075A1
• Time in Patent Office: 1,061 Days
• Field of Search: 607/2, 607/36, 607/116
• US Class Current: 607/2
• CPC Class Codes: A61N 1/0514 Electrodes for the urinary tract
• CPC Class Codes: A61N 1/0521 Genital electrodes
• CPC Class Codes: A61N 1/36007 of urogenital or gastrointestinal organs, e.g. for incontinence control
• CPC Class Codes: A61N 1/36107 Sexual dysfunction stimulating genital organs A61N1/36007
• CPC Class Codes: A61N 1/37205 Microstimulators, e.g. implantable through a cannula
• CPC Class Codes: A61N 1/3756 Casings with electrodes thereon, e.g. leadless stimulators
• CPC Class Codes: A61N 1/3787 from an external energy source

Abstract

An implantable microstimulator includes a plastic housing having a first end; an electronic subassembly; and a conductive plastic electrode disposed at the first end of the plastic housing and in electrical communication with the electronic subassembly. The microstimulator forms a hermetically sealed structure. Optionally, the microstimulator also includes a second electrode disposed at a second end of the plastic housing and in electrical communication with the electronic subassembly. The second electrode may also be a conductive plastic electrode.

Claims

1. An implantable microstimulator, comprising:

a plastic housing consisting essentially of plastic and having a first end and an interior surface;

an electronic subassembly disposed within the plastic housing, wherein the interior surface of the plastic housing forms, at least in part, a surface of a cavity in which the electronic subassembly is disposed; and

a conductive plastic electrode consisting essentially of conductive plastic and disposed at the first end of the plastic housing and in electrical communication with the electronic subassembly;

wherein the microstimulator forms a hermetically sealed structure with the plastic housing and conductive plastic electrode hermetically sealed together.

2. The implantable microstimulator of claim 1, further comprising a second electrode disposed at a second end of the plastic housing and in electrical communication with the electronic subassembly.

3. The implantable microstimulator of claim 2, wherein the second electrode consists essentially of conductive plastic.

4. The implantable microstimulator of claim 2, wherein the plastic housing is a cylinder and the conductive plastic electrode and the second electrode are disposed at opposite ends of the cylinder.

5. The implantable microstimulator of claim 2, wherein the first and second ends are opposing ends of the plastic housing.

6. The implantable microstimulator of claim 2, wherein the plastic housing, the conductive plastic electrode, and the second electrode are metal-free.

7. The implantable microstimulator of claim 1, wherein the conductive plastic electrode is seamlessly joined to the plastic housing.

8. The implantable microstimulator of claim 7, wherein the conductive plastic electrode and plastic housing are formed together using dual material injection molding.

9. The implantable microstimulator of claim 1, wherein the plastic housing and the conductive plastic electrode comprise a same polymer material, wherein the conductive plastic of the conductive plastic electrode comprises the polymer material and a conductive material disposed in the polymer material.

10. The implantable microstimulator of claim 1, wherein the plastic housing comprises polyolefin, polypropylene homopolymer or copolymer, or polyetheretherketone.

11. The implantable microstimulator of claim 1, further comprising a coating disposed over the plastic housing.

12. The implantable microstimulator of claim 1, further comprising an antenna disposed within the plastic housing and coupled to the electronic subassembly to receive signals from an external device.

13. A method of making a microstimulator, the method comprising:

forming a plastic housing consisting essentially of plastic and having a first end and an interior surface;

forming a conductive plastic electrode consisting essentially of conductive plastic;

coupling the conductive plastic electrode to the first end of the plastic housing; and

disposing an electronic subassembly within the plastic housing, wherein the interior surface of the plastic housing forms, at least in part, a surface of a cavity in which the electronic subassembly is disposed.

14. The method of claim 13, wherein forming the plastic housing and forming the conductive plastic electrode comprises forming the plastic housing and conductive plastic electrode together.

15. The method of claim 14, wherein forming the plastic housing and the conductive plastic electrode together comprises forming the plastic housing and the conductive plastic electrode using dual material injection molding.

16. The method of claim 13, further comprising disposing a second electrode at a second end of the plastic housing.

17. The method of claim 16, wherein the second electrode consists essentially of conductive plastic.

18. The method of claim 17, wherein forming the plastic housing, forming the conductive plastic electrode, and coupling the second electrode comprises forming the plastic housing, the conductive plastic electrode, and the second electrode together.

19. The method of claim 18, wherein forming the plastic housing, the conductive plastic electrode, and the second electrode together comprises forming the plastic housing, the conductive plastic electrode, and the second electrode using dual material injection molding.