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Method of fabricating a micro-electromechanical actuating mechanism

  • US 7,331,101 B2
  • Filed: 07/08/2005
  • Issued: 02/19/2008
  • Est. Priority Date: 10/16/1998
  • Status: Expired due to Fees
First Claim
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1. A method of fabricating a micro-electromechanical actuating mechanism on a wafer substrate, the method comprising the steps of:

  • carrying out a CMOS fabrication process on the wafer to form transistor control and drive circuitry;

    depositing sacrificial material on the transistor control and drive circuitry;

    etching the sacrificial material to provide connection access to the drive circuitry;

    carrying out a MEMS fabrication process on the layer of sacrificial material to form a micro-electromechanical actuator connected to the drive circuitry and responsive to electrical signals from the drive circuitry; and

    removing the sacrificial material to free the micro-electromechanical actuator, whereinthe steps of carrying out the CMOS and MEMS fabrication processes are such that the transistor circuitry is interposed between the actuator and the wafer substrate.

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