Method for placing components by means of at least one component placement unit

• US 7,331,105 B2
• Filed: 03/16/2005
• Issued: 02/19/2008
• Est. Priority Date: 03/16/2004
• Status: Expired due to Fees

• Current Assignee: Assembleon B.V.
• Original Assignee: Assembleon B.V.
• Inventors: van der Graaf, Sebastiaan Edward
• Primary Examiner(s): Trinh; Minh
• Assistant Examiner(s): Nguyen; Donghai D.
• Application Number:
  US11/080,675
• Publication Number:
  US 20060085975A1
• Time in Patent Office: 1,070 Days
• Field of Search: 297/09, 297/12, 29832-834, 297/39, 297/40, 348/87, 700/69, 700/302, 702/150, 702/127, 356/243.1
• US Class Current: 29/834
• CPC Class Codes: H05K 13/0413 with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
• CPC Class Codes: H05K 13/0853 Determination of transport trajectories inside mounting machines
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49131 by utilizing optical sighting device
• CPC Class Codes: Y10T 29/49133 with component orienting
• CPC Class Codes: Y10T 29/53178 Chip component

Abstract

Provided is a method and system for placing components by means of at least one component placement unit wherein the component placement unit is moved over a distance between a component pickup position and a component placement position located on a substrate. In addition, a total distance to be covered by the component placement unit is calculated for the number of components to be placed, wherein the number of components to be placed is determined beforehand. This total distance value is subsequently compared with a reference value. If the total distance value is greater than the reference value, the substrate to be provided with the components is rotated with respect to the component pickup position about an axis that extends perpendicularly to the substrate.

Claims

1. A method for placing components by at least one component placement unit, the component placement unit placing each component by moving over a distance between a component pickup position and a component placement position located on a substrate, comprising

(a) calculating a total distance to be covered by the component placement unit for a number of components to be placed when the substrate is in a first position;

(b) comparing the total distance to a reference value, the reference value being a calculated total distance to be covered by the component placement unit for the number of components to be placed when the substrate is in a rotated position that is rotated relative to the first position; and

(c) rotating, if the total distance is greater than the reference value, the substrate onto which the components are to be placed relative to a component pickup position about an axis that extends transversely to the substrate until the determined total distance is smaller than or equal to the reference value to minimize the total distance over which the component placement unit is moved in order to place the number of components on the substrate;

(d) moving the component placement unit over a distance between the component pickup position and the component placement position located on the substrate; and

(e) placing a component on the substrate.

2. The method of claim 1, wherein the reference value is equal to a total distance to be covered by the component placement unit where the substrate has been rotated through a predefined angle.

3. The method of claim 2, further comprising calculating an average distance to be covered from the total distance.

4. The method of claim 3, wherein the reference value is equal to an average distance to be covered between a centre line of the substrate, and a component pickup position wherein the centre line of the substrate extends transversely to a direction of movement of the component placement unit, and a component pickup position.

5. The method of claim 1, further comprising calculating an average distance to be covered from the total distance.

6. The method of claim 1, comprising rotating the substrate in steps of approximately 90 degrees with a rotation system.

7. The method of claim 1, comprising rotating the substrate in steps of approximately 180 degrees with a rotation system.

8. The method of claim 1, wherein the rotation comprises rotation based on a randomly selected angle.

9. The method of claim 1, wherein the total distance to be covered by the component placement unit is determined using design data of the substrate.