Sensor module
First Claim
Patent Images
1. A sensor module comprising:
- a housing;
a low temperature co-fired ceramic substrate located on the housing;
a first sensor located on the low temperature co-fired ceramic substrate, wherein the first sensor comprises a pressure sensor;
a second sensor located on a low temperature co-fired ceramic substrate, wherein the second sensor comprises an accelerometer;
signal processing circuitry located on the low temperature co-fired ceramic substrate; and
a metal shield substantially encapsulating at least one of the first and second sensors.
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Abstract
A sensor module is provided having a compact housing containing a sensor. A low temperature co-fired ceramic substrate is located on the housing. The sensor and signal processing circuitry are located on the low temperature co-fired ceramic substrate. The sensor module further includes a metal shield substantially encapsulating the sensor.
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Citations
11 Claims
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1. A sensor module comprising:
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a housing; a low temperature co-fired ceramic substrate located on the housing; a first sensor located on the low temperature co-fired ceramic substrate, wherein the first sensor comprises a pressure sensor; a second sensor located on a low temperature co-fired ceramic substrate, wherein the second sensor comprises an accelerometer; signal processing circuitry located on the low temperature co-fired ceramic substrate; and a metal shield substantially encapsulating at least one of the first and second sensors. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A vehicle crash sensor comprising:
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a housing; a low temperature co-fired ceramic substrate located on the housing; a first sensor located on the low temperature co-fired ceramic substrate, wherein the first sensor comprises a pressure sensor; a second sensor located on a low temperature co-fired ceramic substrate, said second sensor comprising an accelerometer; signal processing circuitry located on the low temperature co-fired ceramic substrate; and a metal shield on the low temperature co-fired ceramic substrate and substantially encapsulating at least one of the first and second sensors. - View Dependent Claims (8, 9, 10, 11)
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Specification