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Radial flow micro-channel heat sink with impingement cooling

  • US 7,331,380 B2
  • Filed: 08/17/2005
  • Issued: 02/19/2008
  • Est. Priority Date: 08/17/2005
  • Status: Expired due to Fees
First Claim
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1. A heat sink assembly for removing heat from an electronic device, said assembly comprising:

  • a base having a top surface,a lid having a bottom surface in spaced relationship with and parallel to said top surface of said base,said lid defining an inlet opening on an inlet axis,an outer wall extending vertically between said top surface of said base and said bottom surface of said lid and about said inlet axis,a plurality of fins extending upwardly from said top surface of said base and extending radially from an inner circle concentric with said inlet axis toward an outer periphery disposed about said inlet axis for directing the flow of cooling fluid radially from said inlet axis, andcharacterized by a confining plate having a center opening for receiving the flow of coolant fluid from said inlet opening in said lid and extending radially from said center opening above said fins and spaced below said bottom surface of said lid.

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