Method and apparatus for a semiconductor device with a high-k gate dielectric
First Claim
1. A semiconductor device, comprising:
- a semiconductor substrate;
shallow trench isolation regions formed in the substrate to define active device regions between the isolation regions;
a counter-doping channel region formed overlying at least one of the active areas, wherein the counter-doping channel region is doped differently from the semiconductor substrate;
at least one gate dielectric region of high-k material formed over the substrate, and having a top surface and sidewalls;
at least one region of conductive gate electrode material formed over the top surface of the gate dielectric region and having sidewalls coextensive with the sidewalls of the gate dielectric region; and
sidewall spacers formed over the gate electrode sidewalls and the gate dielectric sidewalls extending below the bottom layer of the gate dielectric region.
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Abstract
A process and apparatus for a high-k gate dielectric MOS transistor is described. A substrate is provided, a high-k gate dielectric material is deposited over the substrate, a gate electrode layer is deposited over the dielectric material and a patterning step is performed creating sidewalls of the electrode and dielectric and removing a portion of the substrate. Sidewall material is deposited over the patterned gate electrode and dielectric creating protective sidewalls on the patterned gate electrode and dielectric that extend beneath the bottom of the dielectric. In alternative embodiments a channel material is deposited beneath the high-k gate dielectric and the patterning step removes at least a portion of the channel material beneath the high-k gate dielectric. In alternative embodiments the channel material is counter-doped.
55 Citations
20 Claims
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1. A semiconductor device, comprising:
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a semiconductor substrate; shallow trench isolation regions formed in the substrate to define active device regions between the isolation regions; a counter-doping channel region formed overlying at least one of the active areas, wherein the counter-doping channel region is doped differently from the semiconductor substrate; at least one gate dielectric region of high-k material formed over the substrate, and having a top surface and sidewalls; at least one region of conductive gate electrode material formed over the top surface of the gate dielectric region and having sidewalls coextensive with the sidewalls of the gate dielectric region; and sidewall spacers formed over the gate electrode sidewalls and the gate dielectric sidewalls extending below the bottom layer of the gate dielectric region. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A semiconductor integrated circuit, comprising:
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a semiconductor substrate; a core region defined in the semiconductor substrate; a peripheral region defined in the semiconductor substrate; a first active device formed over the substrate in the core region, comprising a counter-doping channel formed on the substrate, a high-k gate dielectric formed over the substrate, and a gate conductor formed over the high-k gate dielectric; one or more shallow trench isolation regions formed in the core region, the high-k gate dielectric and the gate conductor overlying at least one of the shallow trench isolation regions; a second active device formed in the peripheral region and having a high-k gate dielectric and a gate conductor formed over the substrate; and sidewalls formed over the first active device, the at least one of the shallow trench isolation regions, and the second active device, the sidewalls extending to a depth beneath the bottom of the high-k gate dielectric of the first active device, the second active device, and the at least one of the shallow trench isolation regions, respectfully. - View Dependent Claims (15, 16, 17, 18)
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19. A method for forming a semiconductor device, comprising:
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forming shallow trench isolation regions into a semiconductor substrate; providing insulator material in the shallow trench isolation regions; forming a counter-doping channel over the semiconductor substrate; depositing a high-k gate dielectric material over the semiconductor substrate; depositing a gate electrode material over the high-k gate dielectric material; patterning the gate electrode material to define at least one high-k gate dielectric material, insulated gate area over the semiconductor substrate; etching the gate electrode material, the high-k gate dielectric, counter-doping channel and the semiconductor substrate to form sidewalls of the at least one insulated gate area, the sidewalls extending into the semiconductor substrate; forming sidewall insulators on the at least one insulated gate area, the sidewall insulators extending into the semiconductor substrate to a depth beneath the bottom of the high-k gate dielectric material. - View Dependent Claims (20)
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Specification