Camera module fabrication method including the step of removing a lens mount and window from the mold

• US 7,332,712 B2
• Filed: 02/14/2007
• Issued: 02/19/2008
• Est. Priority Date: 12/08/1999
• Status: Expired due to Term

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Webster, Steven
• Primary Examiner(s): LE, QUE TAN
• Application Number:
  US11/706,726
• Publication Number:
  US 20070152147A1
• Time in Patent Office: 370 Days
• Field of Search: 250/239, 250/208.1, 250/216, 257 80- 85, 257433-440, 438/430, 438/29, 438/25
• US Class Current: 250/239
• CPC Class Codes: G02B 7/02 for lenses supports for magnifying lenses G02B25/002
• CPC Class Codes: G02B 7/022 lens and mount having complementary engagement means, e.g. screw/thread
• CPC Class Codes: H01L 2224/32013 the layer connector being larger than the bonding area, e.g. bond pad
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14627 Microlenses
• CPC Class Codes: H01L 27/14636 Interconnect structures
• CPC Class Codes: H01L 27/14683 Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof not peculiar thereto H01L21/00
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15787 Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 31/0203 : Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/0232 : Optical elements or arrangements associated with the device H01L31/0236 takes precedence; for photovoltaic cells H01L31/054; for photovoltaic modules H02S40/20
• CPC Class Codes: H01L 31/02325 : the optical elements not being integrated nor being directly associated with the device
• CPC Class Codes: H04N 23/54 : Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/55 : Optical parts specially adapted for electronic image sensors; Mounting thereof
• CPC Class Codes: H04N 23/57 : Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
• CPC Class Codes: Y10T 29/49002 : Electrical device making

Abstract

An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window such that the window is exposed through the aperture. A lens is supported in a threaded lens support. The threaded lens support is threaded into the aperture of the lens holder extension portion. The lens is readily adjusted relative to the image sensor by rotating the lens support.

Claims

1. A method of fabricating a camera module comprising:

placing a window in a cavity of a first mold half;

moving a second mold half into a closed position on the first mold half, wherein the second mold half comprises an extension comprising a base, the base of the second mold half pressing against an interior surface of the window;

filling a space around the window and between the first mold half and the second mold half with a molding compound to form a lens mount enclosing the window;

removing the lens mount and window from the first mold half and the second mold half;

coupling an image sensor to a substrate; and

coupling the lens mount to the substrate around the image sensor.

2. The method of claim 1 wherein the extension is an inverse shape of the cavity.

3. The method of claim 1 wherein the extension extends into the cavity and presses on the interior surface of the window.

4. The method of claim 1 wherein the filling comprises heating a molding compound to a melt and forcing the molding compound between the first mold half and the second mold half.

5. The method of claim 1 wherein the lens mount contacts only sides of the window.

6. The method of claim 1 wherein the lens mount comprises an exterior locking feature extending over and contacting a peripheral region of an exterior surface of the window.

7. The method of claim 6 wherein a multi-piece mold comprises the first mold half, the second mold half and a threaded plug, the threaded plug contacting a central region of the exterior surface of the window when the second mold half is in the closed position, the method further comprising:

unscrewing the threaded plug from the lens mount.

8. The method of claim 1 wherein the lens mount comprises an interior locking feature extending over and contacting a peripheral region of the interior surface of the window.

9. The method of claim 8 wherein the base of the second mold half comprises a compliant pad contacting a central region of the interior surface of the window when the second mold half is in the closed position, the filling comprising filling a space between the base of the second mold half and the peripheral region of the interior surface of the window.

10. The method of claim 8 wherein the lens mount further comprises an exterior locking feature extending over and contacting a peripheral region of the exterior surface of the window.

11. The method of claim 10 wherein a multi-piece mold comprises the first mold half, the second mold half and a threaded plug, the threaded plug contacting a central region of the exterior surface of the window when the second mold half is in the closed position and the base of the second mold half comprises a compliant pad contacting a central region of the interior surface of the window when the second mold half is in the closed position, the filling comprising:

filling a space around the threaded plug and between the first mold half and the peripheral region of the exterior surface of the window; and

filling a space between the base of the second mold half and the peripheral region of the interior surface of the window, the method further comprising;

unscrewing the threaded plug from the lens mount.

12. The method of claim 1 wherein the image sensor is coupled to a first surface of the substrate with an adhesive.

13. The method of claim 12 further comprising wirebonding bond pads of the image sensor to traces on the first surface of the substrate.

14. The method of claim 13 wherein the substrate further comprises:

traces on a second surface of the substrate; and

vias electrically coupling the traces on the second surface of the substrate with the traces on the first surface of the substrate.

15. The method of claim 14 further comprising:

forming means for electrically connecting the camera module to a larger substrate, the means for electrically connecting being electrically connected to the traces on the second surface of the substrate.

16. The method of claim 15 wherein the means for electrically connecting is selected from the group consisting of a land grid array and a ball grid array.

17. The method of claim 1 further comprising:

inserting a lens barrel into the lens mount;

rotating the lens barrel to focus the camera module; and

securing the lens barrel to the lens mount.

18. The method of claim 1 wherein the lens mount is coupled to a first surface of the substrate with an adhesive.

19. A method of fabricating an image sensor package comprising:

placing a window in a cavity of a first mold half, the first mold half comprising a compliant pad;

moving a second mold half into a closed position on the first mold half, wherein the second mold half comprises a compliant pad, the compliant pad of the second mold half pressing against a central region of an interior surface of the window, the complaint pad of the first mold half pressing against a central region of an exterior surface of the window;

filling a space around the window and between the first mold half and the second mold half with a molding compound to form a molding enclosing the window, the filling comprising;

filling a space between the first mold half and a peripheral region of the exterior surface of the window; and

filling a space between the second mold half and a peripheral region of the interior surface of the window;

removing the molding and window from the first mold half and the second mold half;

coupling an image sensor to a substrate; and

coupling the molding to the substrate around the image sensor.

20. A method of fabricating a camera module comprising:

placing a window in a cavity of a first mold half;

moving a second mold half into a closed position on the first mold half, wherein the second mold half comprises an extension comprising a base, the base of the second mold half pressing against an interior surface of the window;

filling a space around the window and between the second mold half and the first mold half with a molding compound to form a lens mount enclosing the window;

removing the lens mount and window from the first mold half and the second mold half;

coupling an image sensor to a substrate;

coupling the lens mount to the substrate around the image sensor with an adhesive;

inserting a lens barrel into the lens mount;

rotating the lens barrel to focus the camera module; and

securing the lens barrel to the lens mount.