Method of providing an optoelectronic element with a non-protruding lens
First Claim
1. A mold tool for an optoelectronic device comprising:
- a first mold piece having a surface that defines a first cavity and that defines an aperture within said first cavity;
a second mold piece having a surface which defines a second cavity, said first cavity cooperating with said second cavity to at least partially form a molding compound into a predetermined shape; and
an ejector pin movably located within said aperture to facilitate removal of said compound from said first cavity, wherein said predetermined shape comprising a generally flat surface and a generally contoured surface at least partially within and not extending above said flat surface, said contoured surface including a lens surrounded by a trough, at least a portion of said trough including a sidewall opposite said lens, said predetermined shape embedding at least one optoelectronic element.
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Accused Products
Abstract
An optoelectronic component has a lens that is formed in the surface of an encapsulant surrounding a semiconductor diode element. With respect to emitters, the lens reduces internal reflection and reduces dispersion to increase overall efficiency. With respect to detectors, the lens focuses photons on the active area of the detector, increasing detector sensitivity, which allows a detector having a reduced size and reduced cost for a given application. The lens portion of the encapsulant is generally non-protruding from the surrounding portions of the encapsulant reducing contact surface pressure caused by the optoelectronic component. This non-protruding lens is particularly useful in pulse oximetry sensor applications. The lens is advantageously formed with a contoured-tip ejector pin incorporated into the encapsulant transfer mold, and the lens shape facilitates mold release.
990 Citations
19 Claims
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1. A mold tool for an optoelectronic device comprising:
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a first mold piece having a surface that defines a first cavity and that defines an aperture within said first cavity; a second mold piece having a surface which defines a second cavity, said first cavity cooperating with said second cavity to at least partially form a molding compound into a predetermined shape; and an ejector pin movably located within said aperture to facilitate removal of said compound from said first cavity, wherein said predetermined shape comprising a generally flat surface and a generally contoured surface at least partially within and not extending above said flat surface, said contoured surface including a lens surrounded by a trough, at least a portion of said trough including a sidewall opposite said lens, said predetermined shape embedding at least one optoelectronic element. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A mold for an optoelectronic device comprising:
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a first mold section defining a first cavity; and a second mold section defining a second cavity, wherein the first and second mold sections cooperate to form an encapsulant into a desired shape embedding a plurality of leads and at least one optoelectronic device comprising one of an emitter or a detector of a noninvasive optical oximetry sensor, the shape of the encapsulate including a generally flat surface and a generally contoured surface at least partially within and not extending above said flat surface, said contoured surface including a lens surrounded by a trough, at least a portion of said trough including a sidewall opposite said lens. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification