RFID device and method of making
First Claim
1. A radio frequency identification (RFID) device comprising:
- a substrate;
a patterned conductive layer on the substrate;
a strap; and
at least one crimped electrical connection between the strap and the patterned conductive layer;
wherein the at least one crimped connection passes through the substrate.
1 Assignment
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Accused Products
Abstract
A radio frequency identification (RFID) device includes a conductive pattern, such as an antenna, on one side of a substrate, and a chip, such as part of a strap, electrically coupled to the conductive pattern, and either on an opposite side of the substrate or on the same side of the substrate as the antenna. A method of fabricating the RFID device may include crimping the strap onto the substrate, in contact with a seed layer, which is subsequently used in forming the antenna or other conductive pattern by plating. The seed layer may be a patterned conductive ink layer. Alternatively, the seed layer may be a layer of conductive material deposited on the substrate, such as by vacuum deposition. Parts of the deposited layer may be covered with a patterned mask in order to form the desired configuration of the conductive pattern.
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Citations
20 Claims
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1. A radio frequency identification (RFID) device comprising:
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a substrate; a patterned conductive layer on the substrate; a strap; and at least one crimped electrical connection between the strap and the patterned conductive layer; wherein the at least one crimped connection passes through the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification