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Thin film integrated circuit device

  • US 7,333,072 B2
  • Filed: 03/16/2004
  • Issued: 02/19/2008
  • Est. Priority Date: 03/24/2003
  • Status: Expired due to Fees
First Claim
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1. A thin film integrated circuit device comprising:

  • a first display area;

    a thin film integrated circuit including a plurality of semiconductor films as a plurality of active region formed over an insulating film; and

    a second display area that is formed over the first display area and connected to the thin film integrated circuit,wherein the second display area is a dual emission light-emitting device.

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