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Memory module assembly including a clip for mounting a heat sink thereon

  • US 7,333,338 B2
  • Filed: 03/05/2006
  • Issued: 02/19/2008
  • Est. Priority Date: 03/05/2006
  • Status: Expired due to Fees
First Claim
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1. A memory module assembly comprising:

  • a rectangular printed circuit board having top and bottom faces and two long sides and two short sides between the two long sides, one of the long sides defining an opening therein, the rectangular printed circuit board having a through hole near the other long side;

    a heat-generating electronic component mounted on the top face of the printed circuit board;

    a heat sink mounted on the electronic component; and

    a clip having a pressing portion pushing the heat sink toward the heat-generating electronic component and two latching portions extending from two opposite ends of the pressing portion, each latching portion comprising a retaining hook section;

    wherein the latching portions are respectively extended through the opening and the through hole and the retaining hook sections engage with the bottom face of the printed circuit board, the retaining hook sections extending in a direction substantially parallel the long sides of the printed circuit board.

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