Method of making an electronic fuse with improved ESD tolerance

• US 7,334,320 B2
• Filed: 12/07/2004
• Issued: 02/26/2008
• Est. Priority Date: 12/03/2003
• Status: Active Grant

• Current Assignee: Globalfoundries US Incorporated (GlobalFoundries, Inc.)
• Original Assignee: International Business Machines Corporation
• Inventors: Voldman, Steven H.
• Primary Examiner(s): Tugbang; A. Dexter
• Assistant Examiner(s): PHAN, THIEM D
• Application Number:
  US11/004,846
• Publication Number:
  US 20050121741A1
• Time in Patent Office: 1,176 Days
• Field of Search: 296/23, 298/25, 298/29, 298/31, 298/46, 257/209, 257/529, 365/96, 438/132, 438/601
• US Class Current: 29/623
• CPC Class Codes: H01L 23/5256 comprising fuses, i.e. connections having their state changed from conductive to non-conductive
• CPC Class Codes: H01L 27/0248 for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 29/49107 Fuse making
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

Tolerance to ESD is increased in an electronic fuse by providing at least one non-conductive region adjacent to a conductive region on the surface of an insulator. Such an arrangement reduces the thermal stresses imposed on the insulator in high current applications. Where multiple conductive and adjacent non-conductive regions are disposed on an insulator, the fuse can fail in discrete steps, thus providing a well defined and easily detected transisition to a blown state, as well as providing a stepwise increase in resistance between prescribed resistance values.

Claims

1. A method of making an electronic fuse blow resistor structure, comprising:

forming an insulator film;

forming a mask on the insulator film; and

after forming the mask, forming by deposition a plurality of spaced apart conductive regions on a surface of the insulator film,

wherein the electronic fuse blow resistor structure is structured and arranged to blow in discrete steps.

2. The method of claim 1, further comprising removing the mask to form regions between the plurality of conductive regions.

3. The method of claim 1, wherein the mask is a salicide block mask.

4. The method of claim 1, further comprising depositing an insulator material to form non-conductive regions between the plurality of conductive regions.

5. The method of claim 1, further comprising patterning the mask to allow depositing a first fuse lead in electrical communication with a first end of the plurality of conductive regions and a second fuse lead in electrical communication with a second end of the plurality of conductive regions.

6. The method of claim 5, further comprising forming at least one electrical contact in electrical communication with the first fuse lead and at least one electrical contact in electrical communication with the second fuse lead.

7. The method of claim 1, wherein the plurality of conductive regions comprises a metal.

8. The method of claim 1, wherein the electronic fuse resistor structure comprises a programmable electronic fuse arranged on a resistive insulator film.

9. The method of claim 1, wherein the insulator film comprises a polysilicon film.

10. The method of claim 1, wherein the insulator film comprises a resistive film that forms a resistive element.

11. The method of claim 1, further comprising forming by deposition fuse leads arranged on opposite sides of and in electrical contact with the plurality of conductive regions.

12. The method of claim 1, wherein the plurality of conductive regions comprise a thickness of 100 to 400 Å

.

13. The method of claim 1, wherein the plurality of conductive regions are configured to provide digitized resistance.

14. The method of claim 1, further comprising forming non conductive regions between the plurality of conductive regions, each non conductive region comprising a region at least partially filled with a solid, liquid, or semi-solid non-conductive material.

15. The method of claim 1, further comprising forming non conductive regions between the plurality of conductive regions, each non conductive region comprising a porous material.

16. The method of claim 1, further comprising forming non conductive regions between the plurality of conductive regions, each non conductive region comprising a combination of a gas, a liquid, and a solid.

17. The method of claim 1, wherein the plurality of conductive regions comprise a uniform width and are arranged approximately parallel to one another.

18. The method of claim 1, wherein the plurality of conductive regions comprise salicided regions.

19. The method of claim 1, further comprising:

depositing a first fuse lead in electrical communication with a first end of the plurality of conductive regions and a second fuse lead in electrical communication with a second end of the plurality of conductive regions; and

forming at least one electrical contact in electrical communication with the first fuse lead and at least one electrical contact in electrical communication with the second fuse lead.