Acceleration sensor chip package

• US 7,334,476 B2
• Filed: 10/20/2005
• Issued: 02/26/2008
• Est. Priority Date: 10/22/2004
• Status: Active Grant

• Current Assignee: LAPIS Semiconductor Co., Ltd. (ROHM Co., Ltd.)
• Original Assignee: OKI Electric Industry Company Limited
• Inventors: Ichikawa, Shunji
• Primary Examiner(s): CHAPMAN JR, JOHN E
• Application Number:
  US11/253,543
• Publication Number:
  US 20060086186A1
• Time in Patent Office: 859 Days
• Field of Search: 735/140.1, 735/143.3, 735/143.8
• US Class Current: 73/514.33
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/123 by piezo-resistive elements, e.g. semiconductor strain gauges
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/1461 MEMS

Abstract

An acceleration sensor chip package includes an acceleration sensor chip; a sensor control chip; a re-wiring layer; an outer terminal; a sealing portion; and a substrate. The acceleration sensor chip includes a frame portion; a movable structure; a detection element; and an electrode pad electrically. The re-wiring layer has a wiring portion connected to the electrode pad. The electrode pad is electrically connected to a conductive bump. The sensor control chip has a sensor control electrode pad electrically connected to the conductive bump. The outer terminal is connected to the wiring portion and disposed in the outer region. The sealing portion seals the sensor control chip, the electrode pad, and the re-wiring layer, so that the movable structure is movable. The substrate is attached to the acceleration sensor chip to seal an opening portion.

Claims

1. An acceleration sensor chip package, comprising:

an acceleration sensor chip including a frame portion having an upper surface, a lower surface opposite to the upper surface, an inner region, an outer region surrounding the inner region, an opening portion formed in the inner region and extending from the upper surface to the lower surface, a movable structure having a beam portion extending from the frame portion toward inside the opening portion and a movable portion disposed in the opening portion and supported on the beam portion to be movable, a detection element for detecting a movement of the movable structure, and an electrode pad electrically connected to the detection element and disposed in the outer region;

a re-wiring layer disposed on the outer region and including a wiring portion with two ends, one of said two ends being electrically connected to the electrode pad;

an outer terminal electrically connected to the other of the two ends of the wiring portion;

a conductive bump electrically connected to the electrode pad;

a sensor control chip having a first surface, a second surface opposite to the first surface, and a sensor control electrode pad exposed from the first surface and electrically connected to the conductive bump;

a sealing portion disposed over the acceleration sensor chip for sealing the sensor control chip, the electrode pad, and the re-wiring layer so that the outer terminal is exposed from the sealing portion and the movable structure is capable of operating; and

a substrate attached to the lower surface for sealing the opening portion from below.

2. The acceleration sensor chip package according to claim 1, wherein said electrode pad includes a first electrode pad connected to the detection element and a second electrode pad, said re-wiring layer including a first wiring portion having one end connected to the first electrode pad and the other end connected to the outer terminal, and a second wiring portion having one end connected to the second electrode pad and the other end connected to the outer terminal.

3. The acceleration sensor chip package according to claim 1, wherein said outer terminal includes an electrode post having a top surface exposed from the sealing portion and connected to the other of the two ends of the wiring portion, and a solder ball disposed on and electrically connected to the top surface.

4. The acceleration sensor chip package according to claim 3, wherein said electrode post is embedded in the sealing portion.

5. The acceleration sensor chip package according to claim 1, further comprising a resin ring portion with a closed shape surrounding the opening portion and closely contacting with the frame portion and the first surface of the sensor control chip.

6. The acceleration sensor chip package according to claim 5, wherein said resin ring portion is disposed to fill a gap of the conductive bump.