Non-contact IC module

• US 7,334,734 B2
• Filed: 01/26/2001
• Issued: 02/26/2008
• Est. Priority Date: 01/27/2000
• Status: Expired due to Fees

• Current Assignee: Hitachi Maxell Limited (Hitachi, Ltd.)
• Original Assignee: Hitachi Maxell Limited (Hitachi, Ltd.)
• Inventors: Daido, Kazuhiko, Hino, Yoshiharu
• Primary Examiner(s): LEE, SEUNG H
• Application Number:
  US09/769,293
• Publication Number:
  US 20010011012A1
• Time in Patent Office: 2,587 Days
• Field of Search: 235/492, 235/493, 235/487, 235/441, 235/436, 235/439, 235/451
• US Class Current: 235/492
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop

Abstract

An accessed object having a non-contact IC module including a semiconductor device and a module-side antenna formed extending over two sides of an accessed object, wherein the module-side antenna consists of a first module-side antenna and a second module-side antenna continuous to the first module-side antenna, wherein the first module-side antenna secures a necessary antenna effective area by coming into face-to-face relation with a first apparatus-side antenna on communication apparatus to communicate with the accessed object, and wherein the second module-side antenna is disposed close to the second apparatus-side antenna in an access direction different from the direction in which the first apparatus-side antenna makes access to the accessed object.

Claims

1. An accessed object comprising a non-contact IC module including an IC chip and radio communication antenna coil connected to said semiconductor device,

wherein said radio communication antenna coil is a continuous conductive wiring pattern bent to extend over two surfaces of different directions of said accessed object, and comprising a large and small module side antenna, the small module side antenna locating close to a first side edge, wherein said IC chip is inside the radio communication antenna coil.

2. An accessed object according to claim 1, wherein said semiconductor device and said radio communication antenna coil are formed on a flexible sheet and said sheet is attached to said accessed object.

3. An accessed object according to claim 2, wherein a semiconductor device is provided in that position of said sheet which is away from the bent portion thereof.

4. An accessed object according to claim 1, wherein said radio communication antenna coil is provided in the vicinity of a corner portion of the said accessed object.

5. An accessed body according to claim 1, wherein said accessed object has a casing and said radio communication antenna coil is provided inside said casing.

6. An accessed object according to claim 5, wherein said casing is opaque or translucent.

7. An accessed object according to claim 1, wherein said accessed object is holding an information recording medium.