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Method and apparatus for lubricating microelectromechanical devices in packages

  • US 7,335,535 B2
  • Filed: 10/20/2005
  • Issued: 02/26/2008
  • Est. Priority Date: 03/26/2004
  • Status: Active Grant
First Claim
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1. A method for lubricating a surface of a microelectromechanical device, comprising:

  • attaching the microelectromechanical device to a package substrate;

    disposing a container containing a lubricant on the package substrate and proximate to the device, wherein the containing has an opening for allowing the lubricant to evaporate from inside the container to the surface of the device, wherein the step of disposing the container on the package substrate further comprising;

    fixing the container in the package such that the container can not move; and

    sealing the package substrate with a package cover.

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