Vehicle, display device and manufacturing method for a semiconductor device

• US 7,335,573 B2
• Filed: 11/25/2002
• Issued: 02/26/2008
• Est. Priority Date: 11/30/2001
• Status: Expired due to Term

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Goto, Yuugo, Kuwabara, Hideaki, Takayama, Toru, Maruyama, Junya, Yamazaki, Shunpei
• Primary Examiner(s): MALSAWMA, LALRINFAMKIM HMAR
• Application Number:
  US10/303,080
• Publication Number:
  US 20030162312A1
• Time in Patent Office: 1,919 Days
• Field of Search: 438455-459, 438 22- 26, 438/30
• US Class Current: 438/455
• CPC Class Codes: B60R 11/0229 for displays, e.g. cathodic tubes
• CPC Class Codes: B60R 11/04 Mounting of cameras operative during drive; Arrangement of controls thereof relative to the vehicle
• CPC Class Codes: B60R 2011/004 outside the vehicle
• CPC Class Codes: B60R 2300/202 displaying a blind spot scene on the vehicle part responsible for the blind spot
• CPC Class Codes: B60R 2300/802 for monitoring and displaying vehicle exterior blind spot views
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 21/76251 using bonding techniques
• CPC Class Codes: H01L 2221/68318 Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
• CPC Class Codes: H01L 2221/6835 used as a support during build up manufacturing of active devices
• CPC Class Codes: H01L 2221/68363 used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
• CPC Class Codes: H01L 2221/68386 Separation by peeling
• CPC Class Codes: H01L 27/1218 with a particular composition or structure of the substrate
• CPC Class Codes: H01L 27/1266 the substrate on which the devices are formed not being the final device substrate, e.g. using a temporary substrate
• CPC Class Codes: H10K 59/12 Active-matrix OLED [AMOLED] displays
• CPC Class Codes: H10K 59/1201 Manufacture or treatment
• CPC Class Codes: H10K 71/80 using temporary substrates
• CPC Class Codes: Y02E 10/549 Organic PV cells
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

To provide a semiconductor device in which a layer to be peeled is attached to a base having a curved surface, and a method of manufacturing the same, and more particularly, a display having a curved surface, and more specifically a light-emitting device having a light emitting element attached to a base with a curved surface. A layer to be peeled, which contains a light emitting element furnished to a substrate using a laminate of a first material layer which is a metallic layer or nitride layer, and a second material layer which is an oxide layer, is transferred onto a film, and then the film and the layer to be peeled are curved, to thereby produce a display having a curved surface.

Claims

1. A method of manufacturing a semiconductor device, comprising:

preparing a first substrate on which a metal layer and a metal oxide layer are formed;

forming onto the first substrate a layer to be peeled that contains a semiconductor element so that the layer to be peeled is in contact with the metal oxide layer;

adhering a second substrate to the layer to be peeled with a first adhesive, and sandwiching the layer to be peeled between the first substrate and the second substrate;

separating the layer to be peeled and the first substrate;

adhering a third substrate to the layer to be peeled with a second adhesive, and sandwiching the layer to be peeled between the second substrate and the third substrate;

separating the layer to be peeled and the second substrate by removing the first adhesive; and

curving the third substrate,

wherein the second adhesive and the third substrate serve as a support for the layer to be peeled.

2. A method according to claim 1, wherein, in the separating the layer to be peeled and the second substrate, the first adhesive is dissolved in a solvent and removed to separate the layer to be peeled and the second substrate.

3. A method according to claim 1, wherein the first adhesive is a photosensitive adhesive, and in separating the layer to be peeled and the second substrate, light is irradiated to separate the layer to be peeled and the second substrate.

4. A method according to claim 1, wherein the first substrate and the second substrate are materials which are more rigid than the third substrate.

5. A method according to claim 1, wherein the third substrate is a substrate which is bendable.

6. A method according to claim 1, wherein the layer to be peeled is curved together with the third substrate.

7. A method according to claim 1, wherein the first adhesive is removed by radiating the ultraviolet ray to the first adhesive.

8. A method of manufacturing a semiconductor device, comprising:

preparing a first substrate on which a metal layer and a metal oxide layer are formed;

forming onto the first substrate a layer to be peeled that contains one of a semiconductor element and a light emitting element in which a layer containing an organic compound serves as a light emitting layer so that the layer to be peeled is in contact with the metal oxide layer;

adhering a second substrate to the layer to be peeled with a first adhesive, and sandwiching the layer to be peeled between the first substrate and the second substrate to which a film is applied;

separating the layer to be peeled and the first substrate;

adhering a third substrate to the layer to be peeled with a second adhesive, and sandwiching the layer to be peeled between the second substrate and the third substrate;

separating the film and the second substrate; and

curving the third substrate,

wherein the film, the second adhesive and the third substrate serve as a support for the layer to be peeled.

9. A method according to claim 8, wherein the film is a tape with photosensitive adhesive on both sides or on one side thereof, and in the separating the film and the second substrate, light is irradiated to separate the film and the second substrate.

10. A method according to claim 8, wherein the first substrate and the second substrate are materials which are more rigid than the third substrate.

11. A method according to claim 8, wherein the third substrate is a substrate which is bendable.

12. A method according to claim 8, wherein the layer to be peeled is curved together with the third substrate.

13. A method according to claim 8, wherein the first adhesive is removed by radiating the ultraviolet ray to the first adhesive.

14. A method for manufacturing a semiconductor device, comprising:

preparing a first substrate on which a metal layer and a metal oxide layer are formed;

forming a layer adjacent to a first substrate so that the layer is in contact with the metal oxide layer;

adhering a second substrate to at least a part of the layer with a first adhesive;

separating the layer from the first substrate;

adhering a third substrate to at least a part of the layer with a second adhesive; and

separating the layer from the second substrate by removing the first adhesive,

wherein the layer comprises a semiconductor element;

wherein a surface of the third substrate is curved in at least one direction; and

wherein the second adhesive and the third substrate sent as a support for at least the part of the layer.

15. A method according to claim 14, wherein at least one of the first and the second adhesive release hydrogen when a laser is irradiated.

16. A method according to claim 14, wherein at least one of the first and the second adhesive is removed by etching.

17. A method according to claim 14, wherein the third substrate is bendable at least one direction.

18. A method according to claim 14, wherein the layer to be peeled is curved together with the third substrate.

19. A method according to claim 14, wherein the first adhesive is removed by radiating the ultraviolet ray to the first adhesive.

20. A method for manufacturing a semiconductor device, comprising the steps of:

preparing first substrate on which a metal layer and a metal oxide layer are formed;

forming a layer adjacent to a first substrate so that the layer is in contact with the metal oxide layer;

adhering a second substrate to at least a part of the layer with a first adhesive;

separating the layer from the first substrate;

adhering a third substrate to at least a part of the layer with a second adhesive; and

separating the layer from the second substrate by removing the first adhesive,

wherein the layer comprises a display element;

wherein a surface of the third substrate is curved in at least one direction; and

wherein the second adhesive and the third substrate serve as a support for at least the part of the layer.

21. A method according to claim 20, wherein the display element is electro luminescent element.

22. A method according to claim 20, wherein the display element is liquid crystal element.

23. A method according to claim 20, wherein at least one of the first and the second adhesive release hydrogen when a laser is irradiated.

24. A method according to claim 20, wherein at least one of the first and the second adhesive is removed by etching.

25. A method according to claim 20, wherein the third substrate is bendable at least one direction.

26. A method according to claim 20, wherein the layer to be peeled is curved together with the third substrate.

27. A method according to claim 20, wherein the first adhesive is removed by radiating the ultraviolet ray to the first adhesive.

28. A method for manufacturing a vehicle comprising a semiconductor device, comprising the steps of:

forming a layer adjacent to a first substrate;

adhering a second substrate to at least a part of the layer with a first adhesive;

separating the layer from the first substrate;

curving the layer along a curved surface in the vehicle;

adhering the curved surface in the vehicle to at least a part of the layer after curving the layer; and

separating the layer from the second substrate,

wherein the layer comprises a semiconductor element,

wherein the vehicle is selected from the group consisting of an automobile, an aircraft and a train.

29. A method according to claim 28, wherein the first adhesive release hydrogen when a laser is irradiated.

30. A method according to claim 28, wherein the first adhesive is removed by etching.

31. A method according to claim 28, wherein the curved surface is a surface to which a display device in the vehicle is formed.

32. A method according to claim 31, wherein the display device is provided in a dashboard portion, a front windshield, a rear window or a seat of the vehicle.

33. A method for manufacturing a vehicle comprising a semiconductor device, comprising the steps of:

forming a layer adjacent to a first substrate;

adhering a second substrate to at least a part of the layer with a first adhesive;

separating the layer from the first substrate;

curving the layer along a curved surface in the vehicle;

adhering the curved surface in the vehicle to at least a part of the layer after curving the layer; and

separating the layer from the second substrate,

wherein the layer comprises a display element,

wherein the vehicle is selected from the group consisting of an automobile, an aircraft and a train.

34. A method according to claim 33, wherein the display element is electro luminescent element.

35. A method according to claim 33, wherein the display element is liquid crystal element.

36. A method according to claim 33, wherein the first adhesive release hydrogen when a laser is irradiated.

37. A method according to claim 33, wherein the first adhesive is removed by etching.

38. A method according to claim 33, wherein the curved surface is a surface to which a display device in the vehicle is formed.

39. A method according to claim 38, wherein the display device is provided in a dashboard portion, a front windshield, a rear window or a seat of the vehicle.