Wireless temperature monitoring for an electronics system
First Claim
Patent Images
1. A computer comprising:
- a computer frame;
a RFID transceiver disposed on the frame;
at least one computer component disposed on the frame, the at least one computer component comprising at least one of a central processing unit, a memory unit, and a circuit board;
a temperature sensor disposed on the at least one computer component;
a RFID transponder removably secured, as a label, relative to the at least one computer component, the RFID transponder being independent of circuitry of the at least one computer component and the RFID transponder comprising a memory configured to store a temperature sensed via the temperature sensor and to store an origin identifier of the at least one computer component; and
a manager configured to obtain, via the origin identifier of the at least one computer component, a temperature performance specification of the at least one component, wherein the manager is also configured to affect a target temperature of the at least one computer component of the computer based on the sensed temperature and on the temperature performance specification of the at least one computer component, respectively,wherein the RFID transceiver and the RFID transponder are configured for wireless communication with each other, without communication between the RFID transponder and the circuitry of the at least one computer component, regarding the sensed temperature and the origin identifier of the at least one computer component.
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Abstract
A method of monitoring an electronics system comprises obtaining temperature information via at least one component of the electronics system, and communicating the temperature information from the at least one component to a manager of the electronics system via a wireless communication pathway independent of the components of electronics system.
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Citations
16 Claims
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1. A computer comprising:
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a computer frame; a RFID transceiver disposed on the frame; at least one computer component disposed on the frame, the at least one computer component comprising at least one of a central processing unit, a memory unit, and a circuit board; a temperature sensor disposed on the at least one computer component; a RFID transponder removably secured, as a label, relative to the at least one computer component, the RFID transponder being independent of circuitry of the at least one computer component and the RFID transponder comprising a memory configured to store a temperature sensed via the temperature sensor and to store an origin identifier of the at least one computer component; and a manager configured to obtain, via the origin identifier of the at least one computer component, a temperature performance specification of the at least one component, wherein the manager is also configured to affect a target temperature of the at least one computer component of the computer based on the sensed temperature and on the temperature performance specification of the at least one computer component, respectively, wherein the RFID transceiver and the RFID transponder are configured for wireless communication with each other, without communication between the RFID transponder and the circuitry of the at least one computer component, regarding the sensed temperature and the origin identifier of the at least one computer component. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method of monitoring a computer, the method comprising:
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providing a plurality of computer components of a computer; removably securing a temperature sensor and a RFID transponder onto each respective computer component; sensing temperature information via the sensor of each respective computer component and storing the sensed temperature information in a memory of the RFID transponder of each respective computer component; and communicating the temperature information from the RFID transponder to a RFID transceiver adjacent a position of the manager of the computer via a wireless communication pathway independent of communication with each respective computer component of the computer; evaluating a temperature distribution, via the stored temperature information for each respective computer component, of the respective computer components of the computer relative to a thermal design parameter of the computer, wherein the thermal design parameter of the computer includes a temperature performance specification of each respective computer component; and modifying a thermal design of the computer, via replacing one of the respective computer components, based on the evaluated temperature distribution of the respective components of the computer. - View Dependent Claims (10, 11, 12)
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13. A server comprising:
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a plurality of server components arranged in a predetermined configuration on a chassis as a server; a RFID transceiver disposed on the chassis; an array of RFID transponders in wireless communication with the RFID transceiver with at least one RFID transponder of the array mounted on each respective server component of the plurality of server components, wherein each RFID transponder comprises a memory and a temperature sensor, the memory configured to store a temperature measured by the temperature sensor and to store an origin identifier of each respective server component; and a server manager in communication with the RFID transceiver and including a temperature monitor configured to monitor a temperature of each respective server component of the server system, via wireless communication between the RFID transceiver and the at least one RFID transponder of the respective server components, without communication between the at least one RFID transponder and the respective server component on which the at least one RFID transponder is mounted, wherein the server manager is configured to obtain, via the origin identifier of the respective server component, a temperature parameter of the respective server component, and wherein the server manager is also configured to affect a target temperature of the respective server component based on the sensed temperature and the temperature parameter of the each respective server component. - View Dependent Claims (14, 15, 16)
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Specification