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Method for forming a back-drilled plated through hole in a printed circuit board and the resulting printed circuit board

  • US 7,337,537 B1
  • Filed: 02/15/2006
  • Issued: 03/04/2008
  • Est. Priority Date: 09/22/2003
  • Status: Active Grant
First Claim
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1. A method for forming a plated through hole in a multi-layered printed circuit board, said method comprising the steps of:

  • drilling a first hole having a first diameter through said printed circuit board;

    drilling a second hole having a second diameter concentrically around and through a predetermined depth of said first hole in said printed circuit board;

    plating said second hole and a remaining portion of said first hole in said printed circuit board; and

    back-drilling a third hole having a third diameter concentrically around and through the remaining portion of said plated first hole to remove that portion of said plated first hole and leave said plated second hole which forms the plated through hole in said printed circuit board.

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