Method of manufacturing a structure body bonding with a glass substrate and semiconductor substrate

• US 7,337,540 B2
• Filed: 11/01/2004
• Issued: 03/04/2008
• Est. Priority Date: 11/18/2003
• Status: Expired due to Fees

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Kurosawa, Ryuichi
• Primary Examiner(s): Tugbang; A. Dexter
• Assistant Examiner(s): NGUYEN, TAI V
• Application Number:
  US10/978,928
• Publication Number:
  US 20050142812A1
• Time in Patent Office: 1,219 Days
• Field of Search: 298/901, 298/30, 298/31, 298/32, 296/11, 216/27, 216/36, 216/39, 347/65, 347/62, 347/63, 219/121.68, 219/121.69, 204/192.34, 204/192.32, 204/192.35, 438/455
• US Class Current: 29/890.1
• CPC Class Codes: B32B 15/04 comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material next to a bituminous or tarry layer B32B11/08; next to a water-setting substance layer B32B13/06; next to a glass layer B32B17/061; next to a cellulosic plastic layer B32B23/042
• CPC Class Codes: B32B 17/06 comprising glass as the main or only constituent of a layer, next to another layer of a specific material
• CPC Class Codes: B41J 2/16 Production of nozzles
• CPC Class Codes: C03C 15/00 Surface treatment of glass, not in the form of fibres or filaments, by etching etching or surface-brightening compositions, in general C09K13/00
• CPC Class Codes: C03C 23/0025 by a laser beam
• CPC Class Codes: H01L 21/31111 by chemical means
• CPC Class Codes: Y10T 29/49083 Heater type
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49401 Fluid pattern dispersing device making, e.g., ink jet

Abstract

Provided is technology capable of avoiding complex processes and high costs while securing the protection of the functional unit upon forming a device including a glass substrate. A manufacturing method of a structural body structured with a bonding body formed from a glass substrate and a semiconductor substrate, including a first step of forming a first functional unit as a structural element of the structural body on one face of the glass substrate; a second step of bonding the semiconductor substrate to one face of the glass substrate so as to cover the first functional unit; a third step of forming an affected zone extending in the thickness direction of the glass substrate by irradiating a laser beam from the other face side of the glass substrate and scanning the focal point of the laser beam in the thickness direction of the glass substrate; and a fourth step of forming a hole in the glass substrate by etching the glass substrate and removing the portion along the affected zone.

Claims

1. A manufacturing method of a structural body structured with a bonding body formed from a glass substrate and a semiconductor substrate, comprising:

a first step of forming a first functional unit as a structural element of the structural body on one face of the glass substrate;

a second step of bonding the semiconductor substrate to one face of said glass substrate so as to cover said first functional unit;

a third step of forming an affected zone extending in the thickness direction of said glass substrate by irradiating a laser beam from the other face side of said glass substrate and scanning the focal point of said laser beam in the thickness direction of said glass substrate; and

a fourth step of forming a hole in said glass substrate by etching said glass substrate and removing the portion along said affected zone;

wherein, prior to said second step, a second functional unit is formed as a structural element of said structural body on at least one face of said semiconductor substrate.

2. A manufacturing method of a structural body according to claim 1, wherein said glass substrate contains alkali ion, and said second step bonds said glass substrate and said semiconductor substrate with the anodic bonding method.

3. A manufacturing method of a structural body according to claim 1, wherein said laser beam irradiated in said third step is a pulse laser beam.

4. A manufacturing method of a structural body according to claim 3, wherein said laser beam irradiated in said third step is a femtosecond laser beam.

5. A manufacturing method of a structural body according to claim 1, wherein said hole formed in said fourth step is a through-hole.

6. A manufacturing method of a structural body according to claim 5, further comprising a fifth step of forming a concave portion in communication with said through-hole in said semiconductor substrate by etching said semiconductor substrate via said through-hole formed in said glass substrate.

7. A manufacturing method of a structural body according to claim 1, wherein said third step performs irradiation via alignment based on the shape pattern of said second functional unit formed on said semiconductor substrate.