Method of fabricating a light-emitting device having a planarized color filter

• US 7,338,338 B2
• Filed: 11/22/2004
• Issued: 03/04/2008
• Est. Priority Date: 05/12/2004
• Status: Active Grant

• Current Assignee: InnoLux Corporation
• Original Assignee: TPO Displays Corporation (InnoLux Corporation)
• Inventors: Chang, Shih-Chang, Tsai, Yaw-Ming, Hsieh, Hsiu-Chun
• Primary Examiner(s): WILLIAMS, JOSEPH L
• Application Number:
  US10/995,594
• Publication Number:
  US 20050253506A1
• Time in Patent Office: 1,198 Days
• Field of Search: 313498-512, 445 23- 25
• US Class Current: 445/23
• CPC Class Codes: H10K 59/12 Active-matrix OLED [AMOLED] displays
• CPC Class Codes: H10K 59/38 comprising colour filters or colour changing media [CCM]
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass

Abstract

A light-emitting device and the fabrication method thereof. A substrate is provided. A plurality of active elements are formed on the substrate, defining a plurality of pixel areas. A color filter is formed on the pixel areas. The surface of the color filter is planarized to reduce roughness. An electrode is formed on the color filter. An light-emitting layer is formed on the electrode. A second electrode is formed on the light-emitting layer.

Claims

1. A method of fabricating a light-emitting device, comprising the steps of:

providing a substrate;

forming a color filter on the substrate;

planarizing a surface of the color filter; and

forming a first electrode contacting the color filter.

2. The method as claimed in claim 1, wherein the step of planarizing a surface of the color filter includes planarizing the surface of the color filter to a surface roughness (Ra) less than 10 nm.

3. The method as claimed in claim 1, wherein the step of planarizing a surface of the color filter comprises performing on the surface of the color filter a UV treatment, an O2 plasma treatment, or a polishing.

4. The method as claimed in claim 3, wherein the step of performing a UV treatment comprises performing an excimer UV treatment or a corona treatment.

5. The method as claimed in claim 1, further comprising the step of planarizing a surface of the first electrode.

6. The method of claim 5, wherein the step of planarizing a surface of the first electrode includes performing on the surface of the first electrode a UV treatment, an O2 plasma treatment, or a polishing.

7. The method as claimed in claim 3, wherein the step of performing a polishing includes chemical mechanical polishing.

8. The method as claimed in claim 1, further comprising the steps of forming an organic light-emitting layer on the first electrode and forming a second electrode on the organic light-emitting layer.

9. The method as claimed in claim 8, wherein the first electrode, the organic light-emitting layer and the second electrode comprise a monochromatic organic light-emitting diode.

10. The method as claimed in claim 8, wherein the organic light-emitting layer is a stacked layer comprising an electron-injecting layer, an electron-transport layer, a light-emitting layer, a hole-transport layer, and a hole-injecting layer.

11. The method as claimed in claim 1, wherein the substrate comprises a transparent substrate.

12. The method as claimed in claim 1, wherein the first electrode comprises a transparent conductive material including indium tin oxide (ITO) or indium zinc oxide (IZO).

13. The method as claimed in claim 3, wherein the step of performing an O2 plasma treatment includes exposing the color filter to Ar, O2 or H2O before the step of forming the first electrode.

14. The method as claimed in claim 8, wherein the second electrode comprises a conductive material including one of Ca, Al, Mg, MgAg, AlLi or a combination thereof.

15. The method as claimed in claim 8, further comprising forming active elements on the substrate, wherein the active elements comprise an amorphous-Si thin-film transistor or a poly-Si thin-film transistor.