Light-emitting diode chip package body and packaging method thereof
First Claim
Patent Images
1. A light-emitting diode chip package body, comprising:
- a light-emitting diode chip having a pad-installed surface, a plurality of pads installed on the pad-installed surface, and a rear surface opposite to the pad-installed surface;
a light-reflecting coating disposed on the pad-installed surface, and having a plurality of pad-exposed holes for exposure of the corresponding pads of the light-emitting diode chip;
a surface insulation layer disposed on the rear surface of the light-emitting diode chip and having a central through-hole for exposure of a central portion of the rear surface, the central through-hole being aligned with a central portion of the light-reflecting coating in a normal direction relative to the pad-installed surface and having a width in a transverse direction relative to the normal direction substantially the same as that of the central portion of the light-reflecting coating;
a first light-transparent element received in the central through-hole of the surface insulation layer; and
a plurality of conductive projecting blocks, each of which is disposed on a corresponding pad of the light-emitting diode.
1 Assignment
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Accused Products
Abstract
AN LED chip package body provides an LED chip with a pad-installed surface, a plurality of pads disposed on the pad-installed surface and a rear surface formed opposite the pad-installed surface. The LED chip package body further has a light-reflecting coating disposed on the pad-installed surface of the LED chip and a plurality of pad-exposed holes for exposure of the corresponding pads of the LED chip. The LED chip package body further comprises a light-transparent element disposed on the rear surface of the LED chip and a plurality of conductive projecting blocks. Each of the conductive projecting blocks is disposed on the corresponding pad of the LED chip.
9 Citations
11 Claims
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1. A light-emitting diode chip package body, comprising:
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a light-emitting diode chip having a pad-installed surface, a plurality of pads installed on the pad-installed surface, and a rear surface opposite to the pad-installed surface; a light-reflecting coating disposed on the pad-installed surface, and having a plurality of pad-exposed holes for exposure of the corresponding pads of the light-emitting diode chip; a surface insulation layer disposed on the rear surface of the light-emitting diode chip and having a central through-hole for exposure of a central portion of the rear surface, the central through-hole being aligned with a central portion of the light-reflecting coating in a normal direction relative to the pad-installed surface and having a width in a transverse direction relative to the normal direction substantially the same as that of the central portion of the light-reflecting coating; a first light-transparent element received in the central through-hole of the surface insulation layer; and a plurality of conductive projecting blocks, each of which is disposed on a corresponding pad of the light-emitting diode. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A light-emitting diode chip package body, comprising:
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a light-emitting diode chip having a pad-installed surface formed thereon, a plurality of pads installed on the pad-installed surface and a rear surface formed on an opposite side of the pad-installed surface; a light-reflecting coating disposed on the pad-installed surface and having a plurality of pad-exposed holes for exposure of the corresponding pads of the light-emitting diode; a surface insulation layer disposed on the rear surface of the light-emitting diode chip and having a central through hole for exposure of a central portion of the rear surface; a first light-transparent element received in the central through hole of the surface insulation layer, wherein the first light-transparent element has a planar top portion; a second light-transparent element disposed on the planar top portion of the first light-transparent element, both the first and the second light-transparent element being doped with light-polarizing compound with different wavelengths; and a plurality of conductive projecting blocks, each of the conductive projecting blocks disposed on the corresponding pad of the light-emitting diode.
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8. A light-emitting diode chip package body, comprising:
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a light-emitting diode chip having a pad-installed surface formed thereon, a plurality of pads installed on the pad-installed surface and a rear surface formed on an opposite side of the pad-installed surface; a light-reflecting coating disposed on the pad-installed surface and having a plurality of pad-exposed holes for exposure of the corresponding pads of the light-emitting diode; a surface insulation layer disposed on the rear surface of the light-emitting diode chip and having a central through hole for exposure of a central portion of the rear surface; a first light-transparent element received in the central through hole of the surface insulation layer; and a plurality of conductive projecting blocks, each of the conductive projecting blocks disposed on the corresponding pad of the light-emitting diode, wherein each of the conductive projecting blocks comprises;
a protrusion made of a nonconductive material and disposed on the corresponding pad of the light-emitting diode chip;
a first metal layer formed on the corresponding pad of the light-emitting diode chip for covering a corresponding surface of the pad and the protrusion of the corresponding pad; and
a second metal layer formed on a corresponding first metal layer. - View Dependent Claims (9)
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10. A light-emitting diode chip package body, comprising:
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a light-emitting diode chip having a pad-installed surface formed thereon, a plurality of pads installed on the pad-installed surface and a rear surface formed on an opposite side of the pad-installed surface; a light-reflecting coating disposed on the pad-installed surface and having a plurality of pad-exposed holes for exposure of the corresponding pads of the light-emitting diode; a surface insulation layer disposed on the rear surface of the light-emitting diode chip and having a central through hole for exposure of a central portion of the rear surface; a first light-transparent element received in the central through hole of the surface insulation layer; a plurality of conductive projecting blocks, each of the conductive projecting blocks disposed on the corresponding pad of the light-emitting diode, wherein each of the conductive projecting blocks comprises; a protrusion made of a nonconductive material and disposed on a corresponding bonded metal layer of the light-emitting diode chip; a first metal layer formed on the corresponding bonded metal layer of the light-emitting diode chip for covering a corresponding surface of the bonded metal layer and the protrusion of the corresponding bonded metal layer; and a second metal layer formed on the corresponding first metal layer; and a bonded metal layer formed on the corresponding pad. - View Dependent Claims (11)
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Specification