Semiconductor device and method for fabricating the same

• US 7,339,270 B2
• Filed: 07/25/2006
• Issued: 03/04/2008
• Est. Priority Date: 08/05/2005
• Status: Expired due to Fees

• Current Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Ogawa, Shinichi
• Primary Examiner(s): Picardat; Kevin M.
• Application Number:
  US11/492,007
• Publication Number:
  US 20070032068A1
• Time in Patent Office: 588 Days
• Field of Search: 257/750, 257/751, 257/753, 257/762, 257/767, 438/627, 438/628, 438/643, 438/644, 438/653, 438/654, 438/687
• US Class Current: 257/750
• CPC Class Codes: H01L 21/76831 in via holes or trenches, e.g. non-conductive sidewall liners

Abstract

A semiconductor device has a porous low-dielectric-constant film formed on a substrate and having an opening and a fine particle film composed of a plurality of aggregately deposited fine particles each having a diameter of not less than 1 nm and not more than 2 nm and formed on a surface of the portion of the porous low-dielectric-constant film which is formed with the opening. The fine particles are filled in voids exposed at the surface of the portion of the porous low-dielectric-constant film which is formed with the opening.

Claims

1. A semiconductor device comprising:

a porous low-dielectric-constant film formed on a substrate and having an opening; and

a fine particle film composed of a plurality of aggregately deposited fine particles each having a diameter of not less than 1 nm and not more than 2 nm and formed on a surface of the portion of the porous low-dielectric-constant film which is formed with the opening, wherein

the fine particles are filled in voids exposed at the surface of the portion of the porous low-dielectric-constant film which is formed with the opening.

2. The semiconductor device of claim 1, wherein a conductive material forming a via or an interconnect is buried in the opening such that the fine particle film is interposed between the conductive material and the porous low-dielectric-constant film.

3. The semiconductor device of claim 2, wherein a barrier film is interposed between at least the conductive material and the fine particle film.

4. The semiconductor device of claim 2, wherein the conductive material is Cu.

5. The semiconductor device of claim 1, wherein each of the fine particles is made of a fullerene or silicon dioxide.

6. A method for fabricating a semiconductor device, the method comprising the steps of:

(a) forming a porous low-dielectric-constant film on a substrate;

(b) forming an opening in the porous low-dielectric-constant film; and

(c) coating a solution containing a plurality of fine particles each having a diameter of not less than 1 nm and not more than 2 nm on a surface of the portion of the porous low-dielectric-constant film which is formed with the opening and removing a solvent of the solution therefrom to form a fine particle film composed of the plurality of aggregately deposited fine particles.