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Metallization performance in electronic devices

  • US 7,339,274 B2
  • Filed: 08/17/2004
  • Issued: 03/04/2008
  • Est. Priority Date: 08/17/2004
  • Status: Active Grant
First Claim
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1. An electronic device having design rule of 0.9 μ

  • m or finer comprising

         1) an electrical interconnect configured to electrically connect discrete regions of said electronic device to produce a desired function of said electronic device, said electrical interconnect comprising a patterned metal having two transverse edges and

         2) a material underlying said electrical interconnect wherein the surface of said material includes non-planarities having a height of at least 0.02 μ

    m such that at least 80 percent of the distances between nearest neighbors of said non-planarities that are within 0.1 μ

    m of at least one of said transverse edges of said interconnect is about 100 μ

    m or less.

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