Cooling unit and flow distributing element for use in such unit

• US 7,339,788 B2
• Filed: 05/07/2003
• Issued: 03/04/2008
• Est. Priority Date: 05/08/2002
• Status: Active Grant

• Current Assignee: Danfoss Silicon Power GmbH (Semikron-Danfoss)
• Original Assignee: Danfoss Silicon Power GmbH (Semikron-Danfoss)
• Inventors: Lauridsen, Steen, Eisele, Ronald, Olesen, Klaus Kristen
• Primary Examiner(s): Thompson; Gregory D
• Application Number:
  US10/512,902
• Publication Number:
  US 20050180104A1
• Time in Patent Office: 1,763 Days
• Field of Search: 165/80.4, 361/699
• US Class Current: 361/699
• CPC Class Codes: F28D 2021/0029 Heat sinks
• CPC Class Codes: F28F 13/06 by affecting the pattern of flow of the heat-exchange media F28F13/003 takes precedence; static flow control means in header boxes F28F9/026
• CPC Class Codes: F28F 3/12 Elements constructed in the shape of a hollow panel, e.g. with channels F28D1/02, F28D1/03 take precedence
• CPC Class Codes: F28F 9/0268 in the form of multiple deflectors for channeling the heat exchange medium
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20927 Liquid coolant without phase change

Abstract

A liquid-cooled power semiconductor unit has components to be cooled arranged on the upper side of a plate. The bottom side of the plate is cooled by liquid, which is guided along the plate by means of a distributing element, and the liquid inlet and the liquid outlet of the distributing element are preferably arranged perpendicular to the plate. The distributing element is divided into cells, where each cell has a liquid inlet and a liquid outlet perpendicular to the cooled plate, and the distributing element has multiple cells along the plate.

Claims

1. A cooling unit, for liquid cooling of power semiconductors, which unit cools component(s) arranged on the upper side of at least one plate, the bottom side of said at least one plate being cooled by a liquid, the cooling unit comprising:

a distributing element for guiding the liquid along said plate, said distributing element being divided into cells, each cell having a liquid inlet and a liquid outlet arranged substantially perpendicular to said plate, the liquid flowing through each of said cells in parallel and said distributing element having at least two cells for said plate.

2. The cooling unit according to claim 1, wherein a side of the distributing element facing away from said plate is provided with at least one separating wall creating a first chamber, which connects all liquid inlets with each other, and a second chamber, which connects all liquid outlets with each other, when said distributing element is mounted on a bottom plate.

3. The cooling unit according to claim 1, wherein the distributing element includes a plurality of distributing compartments.

4. The cooling unit according to claim 1, wherein the liquid flow in each cell follows passages, which cause a change of direction of the liquid.

5. The cooling unit according to claim 1, wherein the liquid outlet of one cell is adjacent to the liquid inlet of another cell.

6. The cooling unit according to claim 1, wherein the size of the area covered by each cell is varied across said distributing element.

7. The cooling unit according to claim 6, wherein the size of the areas covered by each cell is larger along the edges than in the centre of distributing element.

8. The cooling unit according to claim 1, wherein the number of changes in flow direction is larger in one cell than in a neighbouring cell.

9. The cooling unit according to claim 1, wherein the plate is made of a material with a low heat conduction resistance.

10. The cooling unit according to claim 1, wherein said plate is the substrate to which the semiconductors are attached.

11. The cooling unit according to claim 10, wherein at least one bridging element is mounted on the plate, the bridging element exerting a downward directed force on the plate.

12. The cooling unit according to claim 3, wherein the distributing element is divided into sections which are arranged at an angle to each other.

13. The cooling unit according to claim 3, wherein the distributing element has transition zones between neighbouring distributing compartments, the transitions zones having fewer inlets and outlets per unit area than the neighbouring distributing compartments.

14. A flow distributing element for use in a cooling unit, said cooling unit comprising a housing and a separating plate and using fluid cooling whereby heat from a fluid on the first side of the separating plate is extracted and diverted away by another fluid on the second side of the plate, wherein the distributing element is placed against the second side of the plate, that the element exhibits cells, each cell having an inlet and an outlet and a closed flow path therebetween.

15. The flow distributing element according to claim 14 wherein the distributing element comprises at least two cells.

16. The flow distributing element according to claim 14, wherein the inlets and outlets are substantially perpendicular to the plate.