Augmenting semiconductor's devices quality and reliability
First Claim
1. A method for augmenting quality or reliability of semiconductor units, comprising:
- (a) providing at least two populations of semiconductor units that are subject to quality or reliability testing;
the at least two populations including at least one quality or reliability fail candidate population and at least one other population;
(b) associating test flows to the at least two populations;
each test flow including a stress testing sequence;
wherein the stress testing sequence for at least one of the quality or reliability fail candidate populations includes a stress test of increased duration as compared to a duration of a stress test in a test flow of at least one of the other populations;
wherein the stress testing sequence for at least one of the other populations includes a stress test of increased voltage as compared to a corresponding operating voltage specification for a semiconductor unit of the semiconductor units; and
(c) applying, within a sort testing stage, a corresponding test flow to each of the at least two populations and identifying any semiconductor unit which failed the stress testing sequence.
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Accused Products
Abstract
A method for augmenting quality or reliability of semiconductor units, including providing few populations of semiconductor units that are subject to quality or reliability testing. The populations include few quality or reliability fail candidate populations and other population(s). The method includes the step of associating test flows to the populations. Each test flow includes stress testing sequence. The stress testing sequence for the quality or reliability fail candidate population includes a stress test of increased duration compared to duration of a stress test in the test flow of the other population. The stress test sequence for the other population includes a stress test of increased voltage compared to corresponding operating voltage specification for a semiconductor unit. The method further includes the step of applying, within a sort testing stage, the corresponding test flow to the populations and identifying any unit which failed the stress sequence.
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Citations
61 Claims
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1. A method for augmenting quality or reliability of semiconductor units, comprising:
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(a) providing at least two populations of semiconductor units that are subject to quality or reliability testing;
the at least two populations including at least one quality or reliability fail candidate population and at least one other population;(b) associating test flows to the at least two populations;
each test flow including a stress testing sequence;
wherein the stress testing sequence for at least one of the quality or reliability fail candidate populations includes a stress test of increased duration as compared to a duration of a stress test in a test flow of at least one of the other populations;
wherein the stress testing sequence for at least one of the other populations includes a stress test of increased voltage as compared to a corresponding operating voltage specification for a semiconductor unit of the semiconductor units; and(c) applying, within a sort testing stage, a corresponding test flow to each of the at least two populations and identifying any semiconductor unit which failed the stress testing sequence. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27)
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28. A method for augmenting quality or reliability of semiconductor units, comprising:
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(a) providing at least two populations of semiconductor units that are subject to quality or reliability testing; (b) associating test flows that include stress testing sequences to the at least two populations;
a first flow from the test flows further including an identical first pre-stress testing sequence and first post-stress testing sequence;
a second flow from the test flows further including an identical second pre-stress testing sequence and a second post-stress testing sequence;
the first and the second stress testing sequences being different; and(c) applying, within a sort testing stage; the test flow that included the first pre-stress testing sequence, the stress testing sequence, and the first post-stress testing sequence, to at least one of the at least two populations; and the test flow that included the second pre-stress testing sequence, the stress testing sequence, and the second post-stress testing sequence, to at least one other of the at least two populations;
for identifying any semiconductor unit which failed the first or second post-stress testing sequence. - View Dependent Claims (29, 30, 31)
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32. A method for augmenting quality or reliability of semiconductor units, comprising:
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(a) providing at least two populations of semiconductor units that are subject to quality or reliability testing;
the at least two populations including at least one quality or reliability fail candidate population and at least one other population;(b) associating test flows to the at least two populations;
each test flow including a stress testing sequence;
the stress testing sequence for at least one of the quality or reliability fail candidate populations including a stress test of increased duration as compared to a duration of a stress test in a test flow of a population of at least one of the other populations;
wherein the stress testing sequence for at least one of the other populations includes a stress test of increased voltage as compared to a corresponding operating voltage specification for the semiconductor unit;(c) applying, within a final testing stage, a corresponding test flow to each of the at least two populations and identifying any semiconductor unit which failed the stress testing sequence.
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33. A method for providing augmented quality or reliability tests configured to be applied to semiconductor units during a testing stage, comprising:
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(a) analyzing data gathered from historical information that pertains to semiconductor units for identifying at least two populations of semiconductor units that are subject to quality or reliability testing;
the at least two populations including at least one quality or reliability fail candidate population and at least one other population;wherein at least one of the quality or reliability fail candidate populations includes a geographical area in a wafer that includes a cluster of at least two consecutive devices, such that any device in the cluster has at least one neighboring device which also belongs to the cluster; and providing at least two different test flows and associating at least one of the at least two different test flows to one of the quality or reliability fail candidate populations, and at least one other test flow of the at least test flows to at least one of the other population;
wherein the at least two different test flows are configured to be applied, within a testing stage, to the associated populations for identifying a semiconductor unit which has failed the test. - View Dependent Claims (34, 35, 36, 42)
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37. A method for providing augmented quality or reliability tests configured to be applied to semiconductor units during a testing stage, comprising:
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(a) analyzing data gathered from historical information that pertain to semiconductor units for identifying at least two populations of semiconductor units that are subject to quality or reliability testing; the at least two populations including at least one quality or reliability fail candidate population and at least one other population; at least one of the quality or reliability fail candidate populations including semiconductor units with the same lithography exposure; and (b) providing at least two different test flows and associating at least one of the at least two different test flows to one of the quality or reliability fail candidate populations, and at least one other test flow of the at least test flows to at least one of the other population;
wherein the at least two different test flows are configured to be applied, within a testing stage, to the associated populations, for identifying a semiconductor unit which has failed the test. - View Dependent Claims (38, 39)
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40. A method for providing augmented quality or reliability tests configured to be applied to semiconductor units during a testing stage, comprising:
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(a) analyzing data gathered from historical information that pertain to semiconductor units for identifying at least two populations of semiconductor units that are subject to quality or reliability testing; the at least two populations including at least one quality or reliability fail candidate population and at least one other population; at least one of the quality or reliability fail candidate populations including semiconductor units with a same relative location across lithography exposures; and (b) providing at least two different test flows and associating at least one of the at least two different test flows to at least one of the quality or reliability fail candidate populations, and associating at least one of an other different test flow to at least one of the other populations, the at least two different test flows being configured to be applied, within a testing stage, to associated populations for identifying a failed semiconductor unit. - View Dependent Claims (41, 43)
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44. A method for providing augmented quality or reliability tests configured to be applied to semiconductor units during a manufacturing stage, comprising:
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(a) analyzing data gathered from historical information that pertains to semiconductor units for identifying at least two populations of semiconductor units that are subject to quality or reliability testing;
the at least two populations including at least one quality or reliability fail candidate population and at least one other population;(b) providing a repertoire of test flows; (c) for at least one of the quality or reliability fail candidate populations performing the following, including; i) providing a reference burn-in units fail score in respect to the quality or reliability fail candidate population of a semiconductor sample; ii) selecting a test flow from the repertoire of test flows; iii) applying the selected test flow to the semiconductor sample of the quality or reliability fail candidate population and logging the tested unit'"'"'s-fail score;
the semiconductor sample being substantially identical to the semiconductor sample of (c) and (i);iv) applying a burn-in test to the quality or reliability fail candidate population of the semiconductor sample of (iii) and logging the tested burn-in units fail score;
wherein units having failed in the tested units fail score are excluded from the burn-in units fail score;v) repeating at least once (ii) to (iv), in respect to different test flow from the repertoire of test flows; vi) determining a prevailing test flow from among the test flows used in (ii), (iii) and (iv), according to a decision criterion;
wherein the decision criterion is dependent at least on the reference burn-in units fail score, and the tested units fail score and tested burn-in units fail score of the prevailing test flow; and
associating the prevailing test flow to the quality or reliability fail candidate population, for applying to semiconductor units during a manufacturing stage. - View Dependent Claims (45, 46, 47, 48, 49, 50)
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51. A method for providing augmented quality or reliability tests configured to be applied to semiconductor units during sort stage, comprising:
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(a) analyzing data gathered from historical information that pertains to semiconductor units for identifying at least one populations of semiconductor units that is subject to quality or reliability testing; (b) associating a respective selected test flow to each one of the at least one populations according to a decision criterion that includes a condition that a fail rate of units in a burn-in test that follows the selected test flow is lower than a fail rate of units in a burn-in test that follows a non-selected test flow.
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52. A system for augmenting quality or reliability of semiconductor units, comprising:
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means including a processor and storage configured to provide at least two populations of semiconductor units that are subject to quality or reliability testing;
the at least two populations including at least one quality or reliability fail candidate population and at least one other population;means including a processor and storage configured to associate test flows to the at least two populations;
each test flow including a stress testing sequence;wherein the stress testing sequence for at least one of said the quality or reliability fail candidate populations includes a stress test of increased duration as compared to a duration of a stress test in the test flow of at least one of the other populations; wherein the stress testing sequence for at least one of the other populations includes a stress test of increased voltage as compared to a corresponding operating voltage specification for a semiconductor unit of the semiconductor units; and means configured to apply, within a testing stage, the corresponding test flow to each population and identifying any semiconductor unit which failed the stress testing sequence. - View Dependent Claims (53, 54, 55)
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56. A system for augmenting quality or reliability of semiconductor units, comprising:
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means including a processor and storage configured to provide at least two populations of semiconductor units that are subject to quality or reliability testing; means including a processor and storage configured to associate test flows that include stress testing sequences to the at least two populations;
a first test flow from among the test flows further including an identical first pre-stress testing sequence and first post-stress testing sequence;
a second test flow from the test flows further including an identical second pre-stress testing sequence and second post-stress testing sequence;
wherein the first and second stress testing sequences are different; andmeans configured to apply, within a testing stage, a test flow that includes the first pre-stress testing sequence, the first stress testing sequence and the first post-stress testing sequence, and a test flow that includes the second pre-stress testing sequence, the second stress testing sequence and the second post-stress testing sequence, to at least one of the at least two populations for identifying any semiconductor unit which failed the first or second post-stress testing sequence. - View Dependent Claims (57, 58, 59)
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60. A computer program product containing a computer readable medium having instructions encoded therein for operation of a computing device, comprising:
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instructions for performing at least one of storing or reading storage data indicative of at least two populations of semiconductor units that are subject to quality or reliability testing, wherein the at least two populations include at least one quality or reliability fail candidate population and at least one other population; instructions for performing at least one of storing or reading test flow information associated with the at least two populations of semiconductor units, wherein the test flow information contains a stress testing sequence, wherein the test stressing sequence for at least one of the quality or reliability fail candidate populations includes a stress test of increased duration as compared to a duration of a stress test in one of the other populations, the stress testing sequence for at least one of the other population including a stress test of increased voltage as compared to a corresponding operating voltage specification for a semiconductor unit of the semiconductor units; and instructions for applying within a testing stage, an association of a corresponding test flow to each of the at least two populations, to enable an identification of a failing semiconductor unit.
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61. A computer program product containing a computer readable medium having instructions encoded therein for operation of a computing device, comprising:
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instructions for performing at least one of storing or reading storage data indicative of at least two populations of semiconductor units that are subject to quality or reliability testing, wherein the at least two populations include at least one quality or reliability fail candidate population and at least one other population; instructions for performing at least one of storing or reading test flow data associated with the at least two populations of semiconductor units, wherein the test flow data includes stress test sequences to the at least two populations, wherein a first test flow from the test flow data includes an identical first pre-stress test sequence and a first post-stress test sequence, and a second test flow from the test flow data includes a second pre-stress test sequence and a second post-stress test sequence, the sequences of the first and second test flow data being different; and instructions to apply, within a testing stage, test flow that include a pre-stress test sequence, an associated stress test sequence, and a post-stress test sequence to at least one of an associated population, to enable an identification of a semiconductor unit that failed the post-stress test sequence.
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Specification