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Low shrink low density laminate formulation

  • US 7,341,785 B2
  • Filed: 06/20/2003
  • Issued: 03/11/2008
  • Est. Priority Date: 08/01/2002
  • Status: Active Grant
First Claim
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1. A laminate composition comprising a paste and filler, wherein the paste comprises,a dicyclopentadiene unsaturated polyester resin;

  • polymeric hollow microspheres; and

    an initiator composition capable of initiating curing at a temperature of 50°

    C. or less, and wherein the filler comprises reinforcing fibers having a length greater than or equal about 6 mm.

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