Electronic unit integrated into a flexible polymer body

• US 7,342,311 B2
• Filed: 01/05/2006
• Issued: 03/11/2008
• Est. Priority Date: 09/13/2004
• Status: Expired due to Fees

• Current Assignee: Lawrence Livermore National Security LLC (Government of the United States of America)
• Original Assignee: Lawrence Livermore National Security LLC (Government of the United States of America)
• Inventors: Rose, Klint A., Strauch, Mark S., Krulevitch, Peter A., Hamilton, Julie K., Benett, William J., Maghribi, Mariam N., Davidson, James Courtney
• Primary Examiner(s): Tran; Long K.
• Application Number:
  US11/326,967
• Publication Number:
  US 20060113537A1
• Time in Patent Office: 796 Days
• Field of Search: 257/57, 257/724, 257/738, 257/730, 257/E23.065, 257/E23.177, 438/706, 438/719, 438/723, 438/780
• US Class Current: 257/730
• CPC Class Codes: B81C 1/0023 Packaging together an electronic processing unit die and a micromechanical structure die MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2221/68345 used as a support during the manufacture of self supporting substrates
• CPC Class Codes: H01L 25/165 Containers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 31/048 Encapsulation of modules
• CPC Class Codes: H01L 31/0543 comprising light concentrating means of the refractive type, e.g. lenses
• CPC Class Codes: Y02E 10/52 PV systems with concentrators

Abstract

A peel and stick electronic system comprises a silicone body, and at least one electronic unit operatively connected to the silicone body. The electronic system is produce by providing a silicone layer on a substrate, providing a metal layer on the silicone layer, and providing at least one electronic unit connected to the metal layer.

Claims

1. An electronic apparatus, comprising:

a spherical silicone body, and at least one electronic unit operatively connected inside said spherical silicone body, wherein said at least one electronic unit comprises a MicroElectroMechanical System (MEMS) sensor.

2. An electronic apparatus, comprising:

a spherical silicone body, and

at least one electronic unit operatively connected inside said spherical silicone body, said at least one electronic unit comprises a microprocessor.

3. An electronic apparatus, comprising:

a spherical silicone body, and

at least one electronic unit operatively connected inside said spherical silicone body, wherein said at least one electronic unit forms a system and the system comprises a magnetometer.

4. An electronic apparatus, comprising:

a spherical silicone body, and

at least one electronic unit operatively connected inside said spherical silicone body, wherein said silicone body comprises a poly(dimethylsiloxane) body.

5. An electronic apparatus, comprising:

a spherical silicone body, and

a plurality of electronic units operatively connected inside said spherical silicone body, wherein said spherical silicone body is a transparent spherical silicone body, wherein said plurality of electronic units containing a solar cell and a MicroElectroMechanical System (MEMS) sensor.

6. An electronic apparatus, comprising:

a spherical silicone body, a first unit integrated into said spherical silicone body, at least one additional unit integrated into said silicone body, and a circuit integrated into said spherical silicone body connected to said first unit and connected to said at least one additional unit wherein said first unit is a MicroElectroMechanical System (MEMS) sensor.

7. An electronic apparatus, comprising:

a spherical silicone body,

a first unit integrated into said spherical silicone body,

at least one additional unit integrated into said silicone body, and

a circuit integrated into said spherical silicone body connected to said first unit and connected to said at least one additional unit wherein said silicone body comprises a poly(dimethylsiloxane) body.

8. An electronic apparatus, comprising:

a spherical silicone body, a first unit integrated into said spherical silicone body, at least one additional unit integrated into said silicone body, and a circuit integrated into said spherical silicone body connected to said first unit and connected to said at least one additional unit, wherein said spherical silicone body is a transparent spherical silicone body and said first unit is a solar cell and said at least one additional unit is a MicroElectroMechanical System (MEMS) sensor.