×

Cross-fill pattern for metal fill levels, power supply filtering, and analog circuit shielding

  • US 7,342,316 B2
  • Filed: 01/26/2006
  • Issued: 03/11/2008
  • Est. Priority Date: 01/30/2004
  • Status: Active Grant
First Claim
Patent Images

1. An integrated circuit including a metal fill pattern comprising:

  • a first plurality of curved metal traces electrically connected to a power supply pad;

    a second plurality of curved metal traces electrically connected to a ground pad; and

    over-routing signal bearing metal lines over said first plurality of metal traces and said second plurality of metal traces;

    wherein said second plurality of metal traces are interdigitated between said first plurality of metal traces to form a purposeful inter-metal capacitance therebetween and to provide electromagnetic shielding to protect circuitry therebelow from said over-routed signal bearing metal lines.

View all claims
  • 9 Assignments
Timeline View
Assignment View
    ×
    ×