Electronic component with semiconductor chips, electronic assembly composed of stacked semiconductor chips, and methods for producing an electronic component and an electronic assembly
First Claim
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1. An electronic component, comprising:
- a semiconductor chip having an active front face, a passive rear face, and at least one side face with a surface;
at least one insulating layer disposed on said active front face, said at least one insulating layer including regions of a silicon dioxide layer and regions of a polyimide layer, said regions of a silicon dioxide layer being in direct contact with said active front face and said regions of a polyimide layer being in direct contact with said regions of a silicon dioxide layer;
an array of structured conductive tracks disposed in direct contact with said regions of a polyimide layer of said at least one insulating layer for providing an electrical connection between said active front face and said passive rear face, said conductive tracks being applied on said surface of said at least one side face;
contact elements including contact surfaces connected to said conductive tracks and contact studs disposed on said conductive tracks on said active front face, said contact surfaces being disposed on said passive rear face;
said active front face including an edge angle of around 63°
to said at least one side face;
said regions of a silicon dioxide layer acting as an etch stop;
said regions of a polyimide layer for protecting said active front face of the semiconductor chip; and
said regions of a silicon dioxide layer and said regions of a polyimide layer including holes therethrough, extending to said active front face, said holes being filled by a contact providing, electrical connection to external contacts in the form of contact studs.
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Abstract
An electronic component includes a semiconductor chip with an active front face and a passive rear face, with contact connections and contact surfaces respectively being provided on the active front face and/or on the passive rear face, and with conductive connections being provided in the form of structured conductive tracks for providing an electrical connection from the active front face to the passive rear face. An electronic assembly formed of stacked semiconductor chips, and a method for producing the electronic component and the electronic assembly are also provided.
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Citations
12 Claims
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1. An electronic component, comprising:
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a semiconductor chip having an active front face, a passive rear face, and at least one side face with a surface; at least one insulating layer disposed on said active front face, said at least one insulating layer including regions of a silicon dioxide layer and regions of a polyimide layer, said regions of a silicon dioxide layer being in direct contact with said active front face and said regions of a polyimide layer being in direct contact with said regions of a silicon dioxide layer; an array of structured conductive tracks disposed in direct contact with said regions of a polyimide layer of said at least one insulating layer for providing an electrical connection between said active front face and said passive rear face, said conductive tracks being applied on said surface of said at least one side face; contact elements including contact surfaces connected to said conductive tracks and contact studs disposed on said conductive tracks on said active front face, said contact surfaces being disposed on said passive rear face; said active front face including an edge angle of around 63°
to said at least one side face;said regions of a silicon dioxide layer acting as an etch stop; said regions of a polyimide layer for protecting said active front face of the semiconductor chip; and said regions of a silicon dioxide layer and said regions of a polyimide layer including holes therethrough, extending to said active front face, said holes being filled by a contact providing, electrical connection to external contacts in the form of contact studs. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. An electronic assembly, comprising:
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stacked electronic components including respective semiconductor chips each having an active front face, a passive rear face, a side face, contact elements including contact studs and contact surfaces, said contact studs being disposed on said active front face and said contact surfaces being disposed on said passive rear face, and each of said semiconductor chips having a respective conductive connection plane extending, via said side face, from said active front face to said passive rear face, each said active front face of a respective semiconductor chip including an insulating layer, said insulating layer including a silicon dioxide layer in direct contact with said active front face and a polyimide layer in direct contact with said silicon dioxide layer, said silicon dioxide layer and said polyimide layer including holes therethrough, extending to said active front face, said holes being filled by a contact providing electrical connection to external contacts in the form of contact studs; and each of said electronic components being connected to another one of said electronic components via said contact studs disposed between a conductive track on said active front face of one of said semiconductor chips and a conductive surface disposed on said passive rear face of an adjacent one of said semiconductor chips; and said passive rear face of one of said semiconductor chips being followed by said active front face of another of said semiconductor chips. - View Dependent Claims (10, 11, 12)
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Specification