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Photonic interconnect system

  • US 7,343,059 B2
  • Filed: 10/11/2003
  • Issued: 03/11/2008
  • Est. Priority Date: 10/11/2003
  • Status: Active Grant
First Claim
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1. An interconnect system comprising:

  • a first circuit unit integrated on a first chip containing a first electronic circuit and a plurality of modulators, wherein;

    the first electronic circuit produces a plurality of electrical output signals; and

    each modulator is controlled by a corresponding one of the electrical output signals and is capable of modulating a corresponding component of a first optical signal output from the first circuit unit; and

    a second circuit unit integrated on a second chip containing a second electronic circuit and a plurality of detectors, wherein;

    the second electronic circuit processes a plurality of electrical input signals; and

    each detector is capable of detecting modulation of a corresponding one of the components of the first optical signal to extract a corresponding one of the input signals, whereinthe first chip and the second chip are mounted on a substrate for transmission of the first optical signal between the first and second chips.

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