System and method for searching for patterns of semiconductor wafer features in semiconductor wafer data

• US 7,343,583 B2
• Filed: 07/08/2005
• Issued: 03/11/2008
• Est. Priority Date: 07/09/2004
• Status: Expired due to Fees

• Current Assignee: ADE Corporation (KLA Corporation)
• Original Assignee: Kla-Tencor Technologies Corporation (KLA Corporation)
• Inventors: Smith, Bryan W., Vergow, Zachary J., Keck, Jay, Kallus, David M.
• Primary Examiner(s): Chiang; Jack
• Assistant Examiner(s): Doan; Nghia M.
• Application Number:
  US11/177,821
• Publication Number:
  US 20060010416A1
• Time in Patent Office: 977 Days
• Field of Search: 716 19- 21, 700/96, 700/121, 700/173, 700/179, 700/180, 709201-203
• US Class Current: 716/51
• CPC Class Codes: G01N 21/9501 Semiconductor wafers manufacturing processes per se of semiconductor devices implementing a measuring step H01L22/10
• CPC Class Codes: G05B 19/41875 characterised by quality surveillance of production
• CPC Class Codes: G05B 2219/2602 Wafer processing
• CPC Class Codes: G06F 16/248 Presentation of query results
• CPC Class Codes: G06Q 10/06 Resources, workflows, human or project management; Enterprise or organisation planning; Enterprise or organisation modelling
• CPC Class Codes: G06Q 50/04 Manufacturing
• CPC Class Codes: H01L 21/67005 Apparatus not specifically provided for elsewhere processes per se H01L21/30, H01L21/46, H01L23/00; simple temporary support means, e.g. using adhesives, electric or magnetic means H01L21/68, H01L21/302
• CPC Class Codes: H01L 21/67253 Process monitoring, e.g. flow or thickness monitoring
• CPC Class Codes: Y02P 90/02 Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
• CPC Class Codes: Y02P 90/30 Computing systems specially adapted for manufacturing

Abstract

A system for the integrated archiving, restoring, purging, importing and exporting of semiconductor wafer data, the system including a data acquisition system for acquiring scan data from differing types of semiconductor wafer scanning tools such as wafer dimensional tools, wafer inspection tools, and wafer nanotopography tools, a buffer system for providing temporary storage for scan data transmitted over a network from the data acquisition system and for providing fault tolerance, a server system for providing storage for the scan data transmitted from the buffer system and converting the scan data into a format used by and stored in a database management system; and an analysis system client station including a display and communicating with the server system over the network, the analysis system and the server system managing the purging, archiving, restoring, importing and exporting of scan data.

Claims

1. A system for searching for patterns of semiconductor wafer features for use in silicon manufacturing and device fabrication processes, comprising:

a communications path;

a data acquisition system capable of acquiring scan data from differing types of semiconductor wafer scanning tools, the data acquisition system being capable of communicating over the communications path;

a buffer system for providing temporary storage for scan data transmitted over the communications path from the data acquisition system and for providing fault tolerance;

a server system for providing storage for the scan data transmitted from the buffer system over the communications path, the server system converting the scan data into a format used by and stored in a database management system; and

an analysis system client station including a display and communicating with the server system over the communications path, the analysis system and the server system providing scan data structuring and query operations and data transfer operations, wherein the analysis system comprises a multiple default wafer layout module which permits a user to designate a default layout from multiple wafer layouts;

wherein the scan data structuring and query operations further comprise dataset parameters for selecting scan data to be used to create a dataset for pattern search purposes, so that scan data can be reused and selectively retained and retrieved from different types of wafer scanning tools;

wherein the data transfer operation farther comprises a system for communicating and sharing scan data; and

wherein the system for communicating and sharing scan data farther comprises a system for enabling a user to select scan data from at least two different wafer manufacturing and fabrication processes to search for patterns in scan data from the selected processes.

2. The system of claim 1, wherein the dataset parameters further comprise wafer filtering criteria for creating composite wafer datasets from at least two different sets of scan data.

3. The system of claim 1, wherein the dataset parameters further comprise wafer filtering criteria for creating wafer datasets using scan data from at least two different types of semiconductor wafer scanning tools.

4. The system of claim 1, wherein the dataset parameters further comprise statistical analysis criteria for calculating statistics about the scan data selected.

5. The system of claim 1, wherein the scan data structuring and query operations further comprise wafer display layout options for visually displaying properties of wafer scan data.

6. The system of claim 3, wherein the scan data structuring and query operations further comprise wafer display layout options for visually displaying scan data from different types of semiconductor wafer scanning tools in alternate views within one display.

7. The system of claim 1, wherein the scan data structuring and query operations further comprise an autonomous updating feature for enabling a user to direct the analysis system to automatically refresh the display at the user'"'"'s analysis system client station to show the most recent scan data as it comes into the system.

8. The system of claim 1, wherein the system for communicating and sharing scan data further comprises a system for enabling a user to select scan data from at least two sites to search for patterns in scan data from the selected sites.

9. The system of claim 1, wherein the system for communicating and sharing scan data further comprises a system for enabling a user to select scan data from at least two different types of wafer scanning tools to search for patterns in scan data from the selected wafer scanning tools.

10. The system of claim 1, wherein the system for communicating and sharing scan data further comprises a system for enabling a user to select scan data from a plurality of sites, wafer scanning tools, and wafer manufacturing and fabrication processes to search for patterns across sites, tools, and processes.

11. The system of claim 1, wherein the communications path further comprises a network.

12. The system of claim 1, wherein the communications path further comprises a computer input and output bus.

13. A method for searching for patterns of semiconductor wafer features for use in silicon manufacturing and device fabrication processes, comprising the steps of:

communicating over a communications path;

acquiring scan data from differing types of semiconductor wafer scanning tools using a data acquisition system, the data acquisition system being capable of communicating over the communications path;

providing temporary storage and fault tolerance for scan data transmitted over the communications path from the data acquisition system by using a buffer system;

providing storage for the scan data transmitted from the buffer system over the communications path using a server system, the server system converting the scan data into a format used by and stored in a database management system; and

analyzing scan data using an analysis system client station including a display and communicating with the server system over the communications path, the analysis system and the server system providing scan data structuring and query operations and scan data transfer operations, wherein the analysis system comprises a multiple default wafer layout module which permits a user to designate a default layout from multiple wafer layouts;

wherein the step of providing scan data structuring and query operations further comprises the step of using dataset parameters for selecting scan data to be used to create a dataset for pattern search purposes, so that scan data can be reused and selectively retained and retrieved from different types of wafer scanning tools;

wherein the step of providing scan data transfer operations further comprises the step of communicating and sharing scan data; and

wherein the step of communicating and sharing scan data further comprises the step of enabling a user to select scan data from at least two different wafer manufacturing and fabrication processes to search for patterns in scan data from the selected processes.

14. The method of claim 13, wherein the step of using dataset parameters further comprise the step of using wafer filtering criteria for creating composite wafer datasets from at least two different sets of scan data.

15. The method of claim 14, wherein the step of using dataset parameters further comprises the step of using wafer filtering criteria for creating wafer datasets using scan data from at least two different types of semiconductor wafer scanning tools.

16. The method of claim 15, wherein the step of providing scan data structuring and query operations further comprises the step of providing wafer display layout options for visually displaying scan data from different types of semiconductor wafer scanning tools in alternate views within one display.

17. The method of claim 13, wherein the step of using dataset parameters further comprises the step of specifying statistical analysis criteria for calculating statistics about the scan data selected.

18. The method of claim 13, wherein the step of providing scan data structuring and query operations further comprises the step of providing wafer display layout options for visually displaying properties of wafer scan data.

19. The method of claim 13, wherein the step of providing scan data structuring and query operations further comprises the step of supplying an autonomous updating feature for enabling a user to direct the analysis system to automatically refresh the display at the user'"'"'s analysis system client station to show the most recent scan data as it comes into the system.

20. The method of claim 13, wherein the step of communicating and sharing scan data further comprises the step of enabling a user to select scan data from at least two sites to search for patterns in scan data from the selected sites.

21. The method of claim 13, wherein the step of communicating and sharing scan data further comprises the step of enabling a user to select scan data from at least two different types of wafer scanning tools to search for patterns in scan data from the selected wafer scanning tools.

22. The method of claim 13, wherein the step of communicating and sharing scan data further comprises the step of enabling a user to select scan data from a plurality of sites, wafer scanning tools, and wafer manufacturing and fabrication processes to search for patterns across said sites, tools, and processes.

23. The method of claim 13, wherein the step of communicating over a communications path further comprises the step of communicating over a network.

24. The method of claim 13, wherein the step of communicating over a communications path further comprises the step of communicating over a computer input and output bus.

25. A software program product implemented on a processor readable medium including instructions performed on a data processor for searching for patterns of semiconductor wafer features for use in silicon manufacturing and device fabrication processes, the instructions comprising:

instructions for communicating over a communications path;

instructions for acquiring scan data from differing types of semiconductor wafer scanning using a data acquisition system, the data acquisition system being capable of communicating over the communications path;

instructions for providing temporary storage and fault tolerance for scan data transmitted over the communications path from the data acquisition system by using a buffer system;

instructions for providing storage for the scan data transmitted from the buffer system over the communications path using a server system, the server system converting the scan data into a format used by and stored in a database management system; and

instructions for analyzing scan data using an analysis system client station including a display and communicating with the server system over the communications path, the analysis system and the sewer system providing scan data structuring and query operations and scan data transfer operations, wherein the analysis system comprises a multiple default wafer layout module which permits a user to designate a default layout from multiple wafer layouts;

wherein the instruction for providing scan data structuring and query operations further comprises instructions for using dataset parameters for selecting scan data to be used to create a dataset for pattern search purposes, so that scan data can be reused and selectively retained and retrieved from different types of wafer scanning tools;

wherein the instruction for providing scan data transfer operations further comprises the instruction for communicating and sharing scan data; and

wherein the instruction for communicating and sharing scan data further comprises the step of enabling a user to select scan data from at least two different wafer manufacturing and fabrication processes instructions to search for patterns in scan data from the selected processes.