Process for manufacturing a composite polymeric circuit protection device
First Claim
1. A process for manufacturing a composite polymeric circuit protection device, said process comprising(1) providing a polymeric assembly comprising(a) providing first and second laminates, each of which comprises a laminar polymer element having two conductive surfaces,(b) providing a pattern of conductive material on at least one of the conductive surfaces on one laminate;
- (c) securing the laminates in a stack in a desired configuration by means of an adhesive, one conductive surface of each of the first and second laminates comprising an external conductive surface of the stack, and(d) making a plurality of electrical connections between a conductive surface of the first laminate and a conductive surface of the second laminate; and
(2) subdividing the assembly into individual devices each of which comprises at least one electrical connection.
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Accused Products
Abstract
A process for manufacturing a composite polymeric circuit protection device in which a polymeric assembly is provided and is then subdivided into individual devices. The assembly is made by providing first and second laminates, each of which includes a laminar polymer element having at least one conductive surface, providing a pattern on at least one of the conductive surfaces on one laminate, securing the laminates in a stack in a desired configuration, at least one conductive surface of at least one of the laminates forming an external conductive surface of the stack, and making a plurality of electrical connections between a conductive surface of the first laminate and a conductive surface of the second laminate. The laminar polymer elements may be PTC conductive polymer compositions, so that the individual devices made by the process exhibit PTC behavior.
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Citations
22 Claims
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1. A process for manufacturing a composite polymeric circuit protection device, said process comprising
(1) providing a polymeric assembly comprising (a) providing first and second laminates, each of which comprises a laminar polymer element having two conductive surfaces, (b) providing a pattern of conductive material on at least one of the conductive surfaces on one laminate; -
(c) securing the laminates in a stack in a desired configuration by means of an adhesive, one conductive surface of each of the first and second laminates comprising an external conductive surface of the stack, and (d) making a plurality of electrical connections between a conductive surface of the first laminate and a conductive surface of the second laminate; and (2) subdividing the assembly into individual devices each of which comprises at least one electrical connection. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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Specification