Micromechanical capacitive acceleration sensor
First Claim
1. A micromechanical capacitive acceleration sensor for picking up an acceleration of an object in at least one direction, said sensor comprising a sensor inertia mass having a center of gravity, a frame structure and a rotation axis movably supporting said sensor inertia mass in said frame structure, said sensor inertia mass comprising a first section forming a first part of a wafer defining a wafer plane in which said rotation axis extends, said sensor inertia mass comprising a second section forming a second part of said wafer and having a center of gravity determining configuration such that said center of gravity of said sensor inertia mass is positioned outside said rotation axis and outside said wafer plane in a direction perpendicularly to said wafer plane, said capacitive acceleration sensor further comprising at least one capacitive pick-up unit for producing at least one capacitive output signal representing a position of said sensor inertia mass relative to said frame structure.
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Accused Products
Abstract
A micromechanical capacitive acceleration sensor is described for picking up the acceleration of an object in at least one direction. The sensor includes a frame structure (110), a sensor inertia mass (101) made of a wafer and movably mounted relative to the frame structure (110) about a rotation axis, and a capacitive pick-up unit (120) for producing at least one capacitive output signal representing the position of the sensor mass (101) relative to the frame structure (110). The sensor inertia mass (101) has a center of gravity which offset relative to the rotation axis in a direction perpendicularly to a wafer plane for measuring accelerations laterally to the wafer plane. The sensor mass (101) and the frame structure (110) are made monolithically of one single crystal silicon wafer. A cover section (112) forms a common connector plane (150) for the connection of capacitor electrodes (125,126). Torqueable elements (105) form an electrically conducting bearing device for the sensor mass (101).
31 Citations
48 Claims
- 1. A micromechanical capacitive acceleration sensor for picking up an acceleration of an object in at least one direction, said sensor comprising a sensor inertia mass having a center of gravity, a frame structure and a rotation axis movably supporting said sensor inertia mass in said frame structure, said sensor inertia mass comprising a first section forming a first part of a wafer defining a wafer plane in which said rotation axis extends, said sensor inertia mass comprising a second section forming a second part of said wafer and having a center of gravity determining configuration such that said center of gravity of said sensor inertia mass is positioned outside said rotation axis and outside said wafer plane in a direction perpendicularly to said wafer plane, said capacitive acceleration sensor further comprising at least one capacitive pick-up unit for producing at least one capacitive output signal representing a position of said sensor inertia mass relative to said frame structure.
- 16. A micromechanical capacitive acceleration sensor for picking up an acceleration of an object in at least one direction (x, y, z), said capacitive acceleration sensor comprising a frame structure which is stationary relative to said object, a sensor inertia mass defining an inertia mass plane, a bearing device elastically supporting said sensor inertia mass for movement relative to said frame structure and for movement relative to a starting position of said sensor inertia mass, said sensor inertia mass having a center of gravity positioned outside said bearing device and outside said inertia mass plane in a direction perpendicularly to said inertia mass plane, said capacitive acceleration sensor further comprising a capacitive pick-up unit for producing at least one capacitive output signal representing a position of said sensor inertia mass relative to said frame structure, said capacitive pick-up unit comprising first capacitor electrodes provided on said sensor inertia mass and second capacitor electrodes provided on said frame structure opposite said first capacitor electrodes, and a coupling arrangement including first connector elements coupled to said first capacitor electrodes, said first connector elements being provided on said frame structure, and second connector elements coupled to said second capacitor electrodes.
Specification