Thermal management methods and apparatus for lighting devices

• US 7,344,279 B2
• Filed: 12/13/2004
• Issued: 03/18/2008
• Est. Priority Date: 12/11/2003
• Status: Active Grant

• Current Assignee: Signify North America Corporation (Signify N.V.)
• Original Assignee: Philips Solid-State Lighting Solutions (Koninklijke Philips N.V.)
• Inventors: Nortrup, Edward, Lys, Ihor A., Mueller, George G., Dowling, Kevin J., Morgan, Frederick M.
• Primary Examiner(s): O'Shea; Sandra
• Assistant Examiner(s): HAN, JASON
• Application Number:
  US11/010,840
• Publication Number:
  US 20050276053A1
• Time in Patent Office: 1,191 Days
• Field of Search: 362/240, 362/249, 362/294, 362/373, 362/800
• US Class Current: 362/294
• CPC Class Codes: F21K 9/23 Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
• CPC Class Codes: F21S 45/43 using gas
• CPC Class Codes: F21S 45/47 Passive cooling, e.g. using fins, thermal conductive elements or openings
• CPC Class Codes: F21V 19/001 the light sources being semiconductors devices, e.g. LEDs
• CPC Class Codes: F21V 23/0457 the sensor sensing the operating status of the lighting device, e.g. to detect failure of a light source or to provide feedback to the device
• CPC Class Codes: F21V 29/54 using thermoelectric means, e.g. Peltier elements
• CPC Class Codes: F21V 29/67 characterised by the arrangement of fans
• CPC Class Codes: F21V 29/677 the fans being used for discharging
• CPC Class Codes: F21V 29/713 in direct thermal and mechanical contact of each other to form a single system
• CPC Class Codes: F21V 29/763 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21V 29/773 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21V 29/83 the elements having apertures, ducts or channels, e.g. heat radiation holes
• CPC Class Codes: F21W 2131/205 for operating theatres
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01R 13/6683 with built-in sensor
• CPC Class Codes: H01R 33/945 Holders with built-in electrical component
• CPC Class Codes: H05B 45/20 : Controlling the colour of the light
• CPC Class Codes: Y10S 362/80 : Light emitting diode

Abstract

Methods and systems are provided for providing active and passive thermal or cooling facilities for LED lighting systems, including radiating and convective thermal facilities, including fans, phase change materials, conductive polymers, potting compounds, vents, ducts, and other thermal facilities.

Claims

1. An apparatus, comprising:

an LED-based lighting device;

a lighting fixture platform having at least one thermally conductive portion;

a lighting socket mounted to the at least one thermally conductive portion and configured to mechanically and electrically engage with the LED-based lighting device; and

at least one mechanical cover configured to exert a force on the LED-based lighting device so as to facilitate a positive mechanical mating of the lighting device and the lighting socket by pushing the lighting device into the lighting socket,

wherein the lighting socket is configured to facilitate a transfer of heat generated by the lighting device from the lighting device to the at least one thermally conductive portion of the lighting fixture platform, via the lighting socket, when the lighting device is engaged in the lighting socket and operated to generate light.

2. The apparatus of claim 1, wherein the lighting socket includes at least one of a mechanical interface and an electrical interface configured to selectively facilitate engagement only with lighting devices having a particular power consumption.

3. The apparatus of claim 1, wherein the lighting device includes a base member adapted to be associated with a conventional light bulb socket.

4. The apparatus of claim 1, wherein the lighting device includes at least one of a thermally conductive back plate, a thermally conductive transfer plate, and a heat sink to facilitate the transfer of heat generated by the lighting device.

5. The apparatus of claim 4, wherein the lighting device includes the thermally conductive back plate, and wherein at least one of the lighting socket and the lighting device is configured such that the thermally conductive back plate of the lighting device is thermally associated with the at least one thermally conductive portion of the lighting fixture platform when the lighting device is engaged in the lighting socket.

6. The apparatus of claim 1, wherein the lighting device includes a housing having at least one vent to facilitate the transfer of the heat generated by the lighting device.

7. The apparatus of claim 1, wherein the lighting device includes a housing having one or more surface treatments to facilitate the transfer of the heat generated by the lighting device.

8. The apparatus of claim 1, wherein the lighting device includes a thermally conductive housing to facilitate the transfer of the heat generated by the lighting device.

9. The apparatus of claim 1, wherein the lighting device includes a puck-shaped housing.

10. The apparatus of claim 1, further comprising at least one sensor associated with the lighting socket.

11. The apparatus of claim 10, wherein the at least one sensor is configured to provide at least one signal indicating a proper engagement of the lighting device in the lighting socket.

12. The apparatus of claim 11, further comprising at least one processor coupled to the lighting socket and configured to monitor the at least one signal provided by the at least one sensor, the at least one processor further configured to control an operating power of the lighting device, when the lighting device is engaged in the lighting socket, based at least in part on the at least one signal provided by the at least one sensor.

13. The apparatus of claim 10, wherein the at least one sensor includes a temperature sensor configured to provide at least one signal representing a heat flow in the apparatus.

14. The apparatus of claim 13, further comprising at least one processor coupled to the lighting socket and configured to monitor the at least one signal provided by the at least one sensor, the at least one processor further configured to control an operating power of the lighting device, when the lighting device is engaged in the lighting socket, based at least in part on the at least one signal provided by the at least one sensor.

15. The apparatus of claim 1, wherein the lighting socket comprises a socket heat transfer member thermally associated with the at least one thermally conductive portion of the lighting fixture platform.

16. The apparatus of claim 15, wherein the lighting device includes a housing and an exposed thermally conductive back plate, and wherein the lighting device is configured such that the thermally conductive back plate makes contact with the socket heat transfer member as the lighting device is engaged with the lighting socket.

17. The apparatus of claim 1, further comprising a flexible thermal transfer member configured to facilitate the transfer of the heat generated by the lighting device, the flexible thermal transfer member including a flexible positive load device that is compressed when the lighting device is engaged with the lighting socket.

18. The apparatus of claim 1, further comprising a thermal transfer facility associated with the lighting socket.

19. The apparatus of claim 18, wherein an inner surface of the thermal transfer facility is configured to become thermally associated with the lighting device when the lighting device is engaged with the lighting socket.

20. The apparatus of claim 19, wherein the lighting device includes a thermally conductive housing, and wherein the inner surface of the thermal transfer facility becomes thermally associated with the thermally conductive housing of the lighting device when the lighting device is engaged with the lighting socket.

21. The apparatus of claim 18, wherein the thermal transfer facility includes at least one sensor to provide at least one signal indicating a presence or absence of the lighting device in the lighting socket.

22. The apparatus of claim 21, wherein the at least one signal provided by the at least one sensor further indicates a proper engagement of the lighting device with the thermal transfer facility.

23. The apparatus of claim 22, further comprising at least one processor coupled to the lighting socket and configured to monitor the at least one signal provided by the at least one sensor, the at least one processor further configured to control an operating power of the lighting device, when the lighting device is engaged in the lighting socket, based at least in part on the at least one signal provided by the at least one sensor.

24. The apparatus of claim 1, further comprising a thermally conductive material configured to thermally associate the lighting device and the lighting socket as the lighting device is engaged in the lighting socket.

25. The apparatus of claim 24, wherein the thermally conductive material is disposed between the lighting device and the lighting socket.

26. The apparatus of claim 24, wherein the thermally conductive material includes a thermally conductive malleable material.

27. The apparatus of claim 24, wherein the thermally conductive material is attached to the lighting device.

28. The apparatus of claim 24, wherein the thermally conductive material is attached to the lighting socket.

29. The apparatus of claim 1, wherein the mechanical mating facilitates the transfer of the heat generated by the lighting device from the lighting device to the at least one thermally conductive portion of the lighting fixture platform.

30. The apparatus of claim 29, wherein the mechanical cover comprises at least one of a lever, a screw, and a snap connector.

31. The apparatus of claim 1, wherein the lighting fixture platform is thermally associated with a thermally conductive building material, such that the heat generated by the lighting device is transferred to the building material.

32. The apparatus of claim 1, wherein the lighting fixture platform is thermally associated with at least one of an electrical junction box and a conduit, such that the heat generated by the lighting device is transferred to the at least one of the electrical junction box and the conduit.

33. A lighting fixture, comprising:

an LED-based lighting device;

a lighting fixture platform having at least one thermally conductive portion;

a lighting socket mounted proximate to the at least one thermally conductive portion and configured to mechanically and electrically engage with the LED-based lighting device; and

at least one mechanical cover configured to exert a force on the LED-based lighting device so as to facilitate a positive mechanical mating of the lighting device and the lighting socket by pushing the LED-based lighting device into the lighting socket,

wherein the lighting socket is configured to facilitate a transfer of heat generated by the LED-based lighting device from the LED-based lighting device to the at least one thermally conductive portion of the lighting fixture platform when the LED-based lighting device is engaged in the lighting socket and operated to generate light.

34. The lighting fixture of claim 33, wherein the LED-based lighting device includes a puck-shaped housing.

35. The lighting fixture of claim 33, wherein the LED-based lighting device includes a thermally conductive housing to facilitate the transfer of the heat generated by the LED-based lighting device.

36. The lighting fixture of claim 33, wherein the LED-based lighting device includes a thermally conductive back plate to facilitate the transfer of the heat generated by the LED-based lighting device.

37. The lighting fixture of claim 36, wherein at least one of the lighting socket and the LED-based lighting device is configured such that the thermally conductive back plate of the LED-based lighting device is thermally associated with the at least one thermally conductive portion of the lighting fixture platform when the LED-based lighting device is engaged in the lighting socket.

38. The lighting fixture of claim 33, further comprising at least one sensor associated with at least one of the lighting socket and the LED-based lighting device and configured to provide at least one sensor signal.

39. The lighting fixture of claim 38, wherein the at least one sensor signal indicates a proper engagement of the LED-based lighting device in the lighting socket.

40. The lighting fixture of claim 39, further comprising at least one processor coupled to the lighting socket and configured to monitor the at least one sensor signal, the at least one processor further configured to control an operating power of the LED-based lighting device, when the LED-based lighting device is engaged in the lighting socket, based at least in part on the at least one sensor signal.

41. The lighting fixture of claim 38, wherein the at least one sensor includes a temperature sensor, and wherein the at least one sensor signal represents a heat flow in the lighting fixture.

42. The lighting fixture of claim 41, further comprising at least one processor coupled to the lighting socket and configured to monitor the at least one sensor signal, the at least one processor further configured to control an operating power of the LED-based lighting device, when the LED-based lighting device is engaged in the lighting socket, based at least in part on the at least one sensor signal.

43. An apparatus, comprising:

an LED-based lighting device;

a lighting fixture platform having at least one thermally conductive portion;

a lighting socket mounted proximate to the at least one thermally conductive portion and configured to mechanically and electrically engage with the LED-based lighting device; and

at least one mechanical cover configured to exert a force on the LED-based lighting device so as to facilitate a positive mechanical mating of the lighting device and the lighting socket by pushing the lighting device into the lighting socket,

wherein the apparatus is configured to facilitate a transfer of heat generated by the lighting device from the lighting device to the at least one thermally conductive portion of the lighting fixture platform via a solid thermal conduction path when the lighting device is engaged in the lighting socket and operated to generate light.

44. An apparatus, comprising:

an LED-based lighting device including a thermally conductive housing to facilitate the transfer of heat generated by the lighting device;

a lighting fixture platform having at least one thermally conductive portion;

a lighting socket mounted proximate to the at least one thermally conductive portion and configured to mechanically and electrically engage with the LED-based lighting device; and

at least one mechanical cover configured to exert a force on the LED-based lighting device so as to facilitate a positive mechanical mating of the lighting device and the lighting socket by pushing the LED-based lighting device into the lighting socket,

wherein the apparatus is configured to facilitate a transfer of the heat generated by the lighting device from the lighting device to the at least one thermally conductive portion of the lighting fixture platform when the lighting device is engaged in the lighting socket and operated to generate light.

45. The apparatus of claim 44, wherein the lighting device includes at least one of a thermally conductive back plate, a thermally conductive transfer plate, and a heat sink to facilitate the transfer of heat generated by the lighting device.

46. The apparatus of claim 45, wherein the lighting device includes the thermally conductive back plate, and wherein at least one of the lighting socket and the lighting device is configured such that the thermally conductive back plate of the lighting device is thermally associated with the at least one thermally conductive portion of the lighting fixture platform when the lighting device is engaged in the lighting socket.

47. The apparatus of claim 44, wherein the lighting device includes a puck-shaped housing.

48. The apparatus of claim 44, wherein the lighting fixture platform is thermally associated with a thermally conductive building material, such that the heat generated by the lighting device is transferred to the building material.

49. The apparatus of claim 44, wherein the lighting fixture platform is thermally associated with at least one of an electrical junction box and a conduit, such that the heat generated by the lighting device is transferred to the at least one of the electrical junction box and the conduit.

50. An apparatus, comprising:

an LED-based lighting device;

a lighting fixture platform having at least one thermally conductive portion;

a lighting socket mounted proximate to the at least one thermally conductive portion and configured to mechanically and electrically engage with the LED-based lighting device; and

at least one mechanical cover configured to exert a force on the lighting device so as to facilitate a positive mechanical mating of the lighting device and the lighting socket by pushing the lighting device into the lighting socket,

wherein the apparatus is configured to facilitate a transfer of heat generated by the lighting device from the lighting device to the at least one thermally conductive portion of the lighting fixture platform when the lighting device is engaged in the lighting socket and operated to generate light;

the apparatus further comprising a thermally conductive material configured to thermally associate the lighting device and the at least one thermally conductive portion of the lighting fixture platform via a contact thermal conduction path when the lighting device is engaged in the lighting socket.

51. The apparatus of claim 50, wherein the thermally conductive material is configured to thermally associate the lighting device and the lighting socket via the contact thermal conduction path when the lighting device is engaged in the lighting socket.

52. The apparatus of claim 51, wherein the thermally conductive material is disposed between the lighting device and the lighting socket.

53. The apparatus of claim 50, wherein the thermally conductive material includes a thermally conductive malleable material.

54. The apparatus of claim 50, wherein the thermally conductive material is attached to the lighting device.

55. The apparatus of claim 50, wherein the thermally conductive material is attached to the lighting socket.

56. A method, comprising acts of:

exerting a force on an LED-based lighting device with at least one mechanical cover so as to facilitate a positive mechanical mating of the lighting device and a lighting socket by pushing the LED-based lighting device into the lighting socket; and

facilitating a transfer of heat generated by the LED-based lighting device that is mechanically and electrically engaged in the lighting socket, the lighting socket being mounted proximate to at least one thermally conductive portion of a lighting fixture platform, the transfer of the heat being from the LED-based lighting device to the lighting fixture platform via a solid thermal conduction path.

57. The method of claim 56, further comprising an act of controlling an operating power of the LED-based lighting device based at least in part on a proper engagement of the LED-based lighting device in the lighting socket.

58. The method of claim 56, further comprising an act of controlling an operating power of the LED-based lighting device based at least in part on a heat flow associated with the LED-based lighting device.

59. The method of claim 56, further comprising an act of transferring the heat generated by the LED-based lighting device from the lighting fixture platform to a thermally conductive building material.

60. The method of claim 56, further comprising an act of transferring the heat generated by the LED-based lighting device from the lighting fixture platform to at least one of an electrical junction box and a conduit.