Wafer level packaging for optoelectronic devices
First Claim
1. An optical device package comprising:
- a) a substrate having an upper surface, a distal end, a proximal end, and at least one longitudinally extending notch;
b) a frame mounted to the substrate the frame including a band-like member surrounding an open area and having at least one recessed portion; and
,c) at least one optical fiber positioned within the at least one longitudinally extending notch and disposed through the recessed portion of the frame.
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Accused Products
Abstract
An optical device package includes a substrate having an upper surface, a distal end, a proximal end, and distal and proximal longitudinally extending notches co-linearly aligned with each other. A structure is mounted to the substrate and has at least one recessed portion. The structure can be a lid or a frame to which a lid is bonded. An optical fiber is positioned within at least one of the proximal longitudinally extending notch and the distal longitudinally extending notch and within the recessed portion of the structure mounted to the substrate. The optical device package can also include conductive legs extending upwardly from bonding pads on the upper surface of the substrate to facilitate flip mounting of the optical device package onto a circuit board or other such platform.
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Citations
22 Claims
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1. An optical device package comprising:
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a) a substrate having an upper surface, a distal end, a proximal end, and at least one longitudinally extending notch; b) a frame mounted to the substrate the frame including a band-like member surrounding an open area and having at least one recessed portion; and
,c) at least one optical fiber positioned within the at least one longitudinally extending notch and disposed through the recessed portion of the frame. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. An optical device package comprising:
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a) a substrate having an upper surface, a distal end, and a proximal end, and at least a first longitudinally extending notch having a proximal end caterminous with the proximal end of the substrate; b) at least one longitudinally oriented optical fiber mounted to the substrate and having a proximal end spaced apart from, and distal to, the proximal end of the notch; and c) a frame comprising a band-like member defining an opening, the frame circumscribing the opening and being mounted to the substrate, the opening exposing the upper surface of the substrate. - View Dependent Claims (16, 17, 18, 19, 20, 21)
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22. An optical device package comprising:
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a) a substrate having an upper surface, a distal end, and a proximal end, and at least a first longitudinally extending notch having a proximal end coterminous with the proximal end of the substrate; b) at least one longitudinally oriented optical fiber mounted to the substrate and having a proximal end spaced apart from, and distal to, the proximal end of the notch; c) an optical semiconductor component mounted to the substrate; and d) a lid for enclosing the optical semiconductor component in an interior space, the lid being mounted to the upper surface of the substrate.
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Specification