Light emitting diode

• US 7,345,322 B2
• Filed: 02/01/2006
• Issued: 03/18/2008
• Est. Priority Date: 02/01/2005
• Status: Expired due to Fees

• Current Assignee: Citizen Electronics Company Limited
• Original Assignee: Citizen Electronics Company Limited
• Inventors: Kikuchi, Satoru
• Primary Examiner(s): Landau; Matthew C.
• Assistant Examiner(s): Yang; Minchul
• Application Number:
  US11/344,603
• Publication Number:
  US 20060169991A1
• Time in Patent Office: 776 Days
• Field of Search: 257/99, 257/100, 257E33056-E33058, 257/E33.066, 257/785, 313/501, 313/500, 313/499, 313/498, 438/117
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/0102 Calcium [Ca]
• CPC Class Codes: H01L 2924/01068 Erbium [Er]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

An LED including a substrate having a pair of terminal electrodes, at least one LED element mounted on the substrate, a frame disposed on the substrate, holes provided in the substrate, concave portions provided in positions of the frame facing the holes, and a pair of conductive elastic members provided between the frame and the substrate, each of the conductive elastic members including a large diameter portion inserted in the corresponding concave portion and a small diameter portion inserted in the corresponding hole and electrically connected to the large diameter portion, the large diameter portions of the pair of conductive elastic members being electrically connected to the pair of terminal electrodes, respectively, and each of the large diameter portions having one end portion which is in contact with a bottom surface of the concave portion and each of the small diameter portions having one end portion which is disposed to project from the hole of the substrate.

Claims

1. A light emitting diode including a substrate having a pair of terminal electrodes, at least one light emitting diode element mounted on the substrate, and a frame disposed on the substrate around the at least one light emitting diode element,

the light emitting diode comprising:

a pair of holes, each of the holes disposed adjacent to each of the pair of terminal electrodes and penetrating the substrate, respectively;

a pair of concave portions, each of the concave portions provided in a position of the frame facing each of the holes; and

a pair of conductive elastic members, each of the members provided between the frame and the substrate, respectively;

wherein each of the conductive elastic members includes a large diameter portion inserted in each of the concave portions of the frame and a small diameter portion which is inserted in each of the holes of the substrate and electrically connected to the large diameter portion,

wherein each of the large diameter portions is electrically connected to each of the terminal electrodes of the substrate, and

wherein each of the large diameter portions has one end portion which is in contact with a bottom surface of the concave portion and each of the small diameter portions has one end which is disposed to project from each of the holes in the substrate.

2. An electronics device comprising:

the light emitting diode according to claim 1;

a mother board on which the light emitting diode is mounted; and

a case containing the light emitting diode,

wherein the small diameter portions of the conductive elastic members are pressed onto printed wirings on the mother board to be electrically connected, respectively, and

wherein the light emitting diode is held in the case.

3. The light emitting diode according to claim 1,

wherein each of the large diameter portions of the conductive elastic members is held in a compressed state between the substrate and the frame.

4. The light emitting diode according to claim 1,

wherein an outer diameter of each of the large diameter portions is set to be larger than an inner diameter of each of the holes provided in the substrate, and smaller than an inner diameter of each of the concave portions provided in the frame.

5. The light emitting diode according to claim 1,

wherein the one end portion of each of the large diameter portions is in contact with the bottom surface of the concave portion of the frame and the other end portion of each of the large diameter portions is in contact with each of the terminal electrodes disposed on the substrate to be electrically connected, and

wherein one portion of each of the small diameter portions is disposed inside each large diameter portion, one end of each small diameter portion is electrically connected to the one end portion of each large diameter portion, and the other end portion of each small diameter portion is disposed to project from each hole of the substrate.

6. The light emitting diode according to claim 1,

wherein the large diameter portion and the small diameter portion of each of the conductive elastic members are separately formed,

wherein the one end portion of each of the large diameter portions is in contact with the bottom surface of the concave portion of the frame and the other end portion of each of the large diameter portions is in contact with each of the terminal electrodes of the substrate to be electrically connected, and

wherein one end portion of each of the small diameter portions is electrically connected to the one end portion of the large diameter portion to be electrically connected, and the other end portion of each small diameter portion is disposed to project from each hole of the substrate.

7. The light emitting diode according to claim 1,

wherein the conductive elastic members comprise conductive coil springs or conductive plate springs.

8. The light emitting diode according to claim 1,

wherein an inner diameter of each of the holes provided in the substrate is set to be smaller than that of each of the concave portions provided in the frame.

9. The light emitting diode according to claim 1,

wherein the frame and the substrate are fixed by an adhesive or adhesive sheet.

10. The light emitting diode according to claim 1,

wherein the frame comprises a reflective frame to reflect light emitted from the light emitting diode element.

11. The light emitting diode according to claim 1,

wherein the large diameter portion and the small diameter portion in each of the pair of conductive elastic members are integrally formed.

12. The light emitting diode according to claim 1,

wherein the large diameter portion and the small diameter portion in each of the pair of conductive elastic members are independently formed.

13. The light emitting diode according to claim 12,

wherein the small diameter portion has one end portion which is inserted in and electrically connected to the large diameter portion.