Stackable integrated circuit packaging
First Claim
Patent Images
1. An apparatus comprising:
- an integrated circuit die;
an integrated circuit package coupled to the integrated circuit die;
mold compound in contact with the integrated circuit die and the integrated circuit package;
a first solder ball in contact with the integrated circuit package;
a second integrated circuit package; and
a second solder ball, wherein the second solder ball is in contact with the second integrated circuit package, and in contact with the mold compound,wherein the first solder ball comprises a greater radius and a greater circumference than the second solder ball,wherein a first portion of the first solder ball is in contact with the mold compound, wherein a second portion of the first solder ball is not in contact with the mold compound, wherein the mold compound defines an opening, wherein the second portion of the first solder ball is recessed beneath the opening, wherein a third portion of the first solder ball is in contact with the integrated circuit package, and wherein the second solder ball is in contact with the first solder ball within the opening.
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Abstract
A system may include an integrated circuit die, an integrated circuit package coupled to the integrated circuit die, mold compound in contact with the integrated circuit die and the integrated circuit package, and an interconnect coupled to the integrated circuit package. A first portion of the interconnect may be in contact with the mold compound, a second portion of the interconnect might not contact the mold compound, and a third portion of the interconnect may be in contact with the integrated circuit package.
303 Citations
13 Claims
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1. An apparatus comprising:
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an integrated circuit die; an integrated circuit package coupled to the integrated circuit die; mold compound in contact with the integrated circuit die and the integrated circuit package; a first solder ball in contact with the integrated circuit package; a second integrated circuit package; and a second solder ball, wherein the second solder ball is in contact with the second integrated circuit package, and in contact with the mold compound, wherein the first solder ball comprises a greater radius and a greater circumference than the second solder ball, wherein a first portion of the first solder ball is in contact with the mold compound, wherein a second portion of the first solder ball is not in contact with the mold compound, wherein the mold compound defines an opening, wherein the second portion of the first solder ball is recessed beneath the opening, wherein a third portion of the first solder ball is in contact with the integrated circuit package, and wherein the second solder ball is in contact with the first solder ball within the opening. - View Dependent Claims (2, 3, 4, 5, 6)
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7. An apparatus comprising:
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an integrated circuit package substrate; a plurality of integrated circuit die coupled to the integrated circuit package substrate; mold compound in contact with the plurality of integrated circuit die and the integrated circuit package substrate; a first solder ball in contact with the integrated circuit package substrate and electrically coupled to one of the plurality of integrated circuit die; a second integrated circuit package; and a second solder ball, wherein the second solder ball is in contact with the second integrated circuit package, and in contact with the mold compound, wherein the first solder ball comprises a greater radius and a greater circumference than the second solder ball, wherein a first portion of the first solder ball is in contact with the mold compound, wherein a second portion of the first solder ball is not in contact with the mold compound, wherein the mold compound defines an opening, wherein the second portion of the first solder ball is recessed beneath the opening, wherein a third portion of the first solder ball is in contact with the integrated circuit package substrate, and wherein the second solder ball is in contact with the first solder ball within the opening. - View Dependent Claims (8, 9)
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10. A system comprising:
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an integrated circuit die; an integrated circuit package in contact with the integrated circuit die; mold compound in contact with the integrated circuit die and the integrated circuit package; and a first solder ball coupled to the integrated circuit package; a second integrated circuit die; a second integrated circuit package; a second solder ball, wherein the second solder ball is in contact with the second integrated circuit package, and in contact with the mold compound; and a double data rate memory electrically coupled to the integrated circuit die, wherein the first solder ball comprises a greater radius and a greater circumference than the second solder ball, wherein a first portion of the first solder ball is in contact with the mold compound, wherein a second portion of the first solder ball is not in contact with the mold compound, wherein the mold compound defines an opening, wherein the second portion of the first solder ball is recessed beneath the opening, wherein a third portion of the first solder ball is in contact with the integrated circuit package, and wherein the second solder ball is in contact with the first solder ball within the opening. - View Dependent Claims (11, 12, 13)
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Specification