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Method and apparatus for characterizing microelectromechanical devices on wafers

  • US 7,345,806 B2
  • Filed: 06/23/2004
  • Issued: 03/18/2008
  • Est. Priority Date: 06/23/2004
  • Status: Active Grant
First Claim
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1. A method of evaluating a quality of a plurality of microelectromechanical devices on a wafer, each microelectromechanical device having a reflective and deflectable plate attached to a deformable hinge that is held on the wafer;

  • the method comprising;

    measuring a distribution of a resonant frequency of the microelectromechanical device comprising;

    illuminating a number of the reflective and deflectable plates with a light beam;

    applying an AC voltage to the number of plates such that the plates oscillate in vicinity of their equilibrium states; and

    sweeping the frequency of the AC voltage, and measuring the frequency response of the reflected light beam from the illuminated plates; and

    evaluating and displaying said quality of a uniformity of the microelectromechanical device on the wafer based on the measured distribution of the resonant frequency.

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