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Processing device

  • US 7,345,883 B2
  • Filed: 03/12/2007
  • Issued: 03/18/2008
  • Est. Priority Date: 05/20/1992
  • Status: Expired due to Fees
First Claim
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1. A processing device comprising:

  • a heat conductive element;

    a processor coupled to said heat conductive element, wherein said processor generates heat when energized, and wherein said heat conductive element dissipates heat generated by said processor;

    a circuit board comprising a mounting area, wherein said processor is mounted to the circuit board;

    a heat dissipating material between the heat conductive element and the processor, wherein the heat dissipating material is coupled to the heat conductive element and the processor; and

    a biasing element adapted to push the circuit board towards the heat conductive element, wherein the heat conductive element is in the form of a plate, and wherein the processing device further comprises a plurality of pins coupled to the processor.

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