Integral resonator gyroscope

• US 7,347,095 B2
• Filed: 08/08/2005
• Issued: 03/25/2008
• Est. Priority Date: 08/12/2002
• Status: Expired due to Term

• Current Assignee: California Institute of Technology, The Boeing Co.
• Original Assignee: California Institute of Technology, The Boeing Co.
• Inventors: Hayworth, Ken J., Wiberg, Dean V., Yee, Karl Y., Shcheglov, Kirill V., Challoner, A. Dorian
• Primary Examiner(s): KWOK, HELEN C
• Application Number:
  US11/199,004
• Publication Number:
  US 20050274183A1
• Time in Patent Office: 960 Days
• Field of Search: 735/040.2, 735/040.4, 735/041.2, 735/041.5, 735/142.9, 735/143.2, 735/041.3
• US Class Current: 73/504.13
• CPC Class Codes: B81C 3/001 Bonding of two components
• CPC Class Codes: G01C 19/5684 the devices involving a micromechanical structure
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49007 Indicating transducer
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor

Abstract

The present invention discloses an inertial sensor having an integral resonator. A typical sensor comprises a planar mechanical resonator for sensing motion of the inertial sensor and a case for housing the resonator. The resonator and a wall of the case are defined through an etching process. A typical method of producing the resonator includes etching a baseplate, bonding a wafer to the etched baseplate, through etching the wafer to form a planar mechanical resonator and the wall of the case and bonding an end cap wafer to the wall to complete the case.

Claims

1. A sensor, comprising:

a planar mechanical resonator for sensing motion of the sensor; and

a case for housing the resonator;

wherein the resonator and a wall of the case are defined through an etching process and the planar resonator is supported at a central mounting point of the planar mechanical resonator and the sensor further comprises a rigid support for the planar resonator providing a rigid attachment carrying substantially no vibratory loads between the case and the resonator at the central mounting point of the resonator.

2. The sensor of claim 1, wherein the case comprises a vacuum housing.

3. The sensor of claim 1, wherein the resonator and the wall are produced from a common wafer.

4. The sensor of claim 1, wherein connect pins pass electrical signals from a baseplate to an end cap wafer of the case to provide electrical connection for exciting the resonator and sensing motion of the resonator.

5. The sensor of claim 1, further comprising control electronics within the case for exciting and sensing movement of the resonator.

6. The sensor of claim 1, wherein metal traces pass through the case to provide electrical connection for exciting the resonator and sensing motion of the resonator.

7. The sensor of claim 1, further comprising at least one excitation electrode within an interior of the planar mechanical resonator to excite in-plane vibration of the resonator;

and

at least one sensing electrode within the interior of the resonator for sensing the motion of the excited resonator.

8. The sensor of claim 1, wherein the case further comprises a baseplate supporting the resonator and the wall and an end cap wafer disposed on the wall of the case.

9. The sensor of claim 8, wherein connect pins pass electrical signals from the baseplate to the end cap wafer of the case to provide electrical connection for exciting and sensing movement of the resonator.

10. The sensor of claim 8, wherein metal bonding is used to fuse the baseplate to the wall and the wall to the end cap wafer to vacuum seal the case.

11. The sensor of claim 8, wherein the end cap wafer includes control electronics for exciting the resonator and sensing motion of the resonator.

12. The sensor of claim 11, wherein electrical signals of exciting and sensing electrodes of the resonator are connected from baseplate metal traces by connect pins to the end cap wafer of the case to provide electrical connection with the control electronics on the end cap wafer.

13. The sensor of claim 12, wherein end cap metal traces pass through the case between the wall and the end cap to communicate sensing information from the control electronics.

14. The sensor of claim 1, wherein the planar mechanical resonator comprises a plurality slots.

15. The sensor of claim 14, wherein the plurality of slots are arranged in an symmetric annular pattern around the central mounting point.

16. The sensor of claim 14, wherein at least one excitation electrode and at least one sensing electrode are disposed within one or more of the plurality of slots.

17. The sensor of claim 16, wherein the at least one excitation electrode and the at least one sensing electrode are disposed within one or more inner slots of the plurality of slots.

18. The sensor of claim 1, wherein in-plane vibration comprises substantially radial motion about the central mounting point.

19. The sensor of claim 1, wherein vibration of the planar resonator is substantially isolated from the rigid support.

20. The sensor of claim 1, wherein the planar mechanical resonator comprises four masses, each having a simple degenerate pair of in-plane vibration modes.

21. The sensor of claim 20, wherein the planar mechanical resonator has two degenerate in-plane system modes producing symmetric motion of the four masses for Coriolis sensing.

22. A sensor, comprising:

a planar mechanical resonator means for sensing motion of the sensor; and

a case means for housing the resonator;

wherein the resonator means and a wall of the case means are defined through an etching process and the planar resonator means is supported at a central mounting point of the planar mechanical resonator means and the sensor further comprises a rigid support for the planar resonator providing a rigid attachment carrying substantially no vibratory loads between the case means and the resonator means at the central mounting point of the resonator.