Rigid flexible printed circuit board and method of fabricating same

• US 7,347,950 B2
• Filed: 08/29/2005
• Issued: 03/25/2008
• Est. Priority Date: 02/25/2005
• Status: Expired due to Fees

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Park, Young Po, Kim, Dong Kuk, Yoon, Young Seok, Myung, Bum Young, Yang, Dek Gin
• Primary Examiner(s): CULBERT, ROBERTS P
• Application Number:
  US11/214,965
• Publication Number:
  US 20060193970A1
• Time in Patent Office: 939 Days
• Field of Search: 216/13, 216 17- 20, 174/254, 174/256, 298/46, 428/209
• US Class Current: 216/13
• CPC Class Codes: C23C 26/00 Coating not provided for in groups C23C2/00 - C23C24/00
• CPC Class Codes: C23C 28/00 Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
• CPC Class Codes: C23C 28/023 only coatings of metal elements only
• CPC Class Codes: H05K 2201/0187 with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
• CPC Class Codes: H05K 2201/0355 Metal foils
• CPC Class Codes: H05K 2201/0382 Continuously deformed conductors
• CPC Class Codes: H05K 2201/09109 Locally detached layers, e.g. in multilayer
• CPC Class Codes: H05K 2203/063 of preperforated insulating layer
• CPC Class Codes: H05K 3/4652 Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern H05K3/4647 takes precedence
• CPC Class Codes: H05K 3/4691 Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

A rigid flexible printed circuit board (PCB) and a method of fabricating the same. Since a polyimide copper clad laminate is not used during the fabrication of the rigid flexible PCB, an increase in cost resulting from use of the polyimide copper clad laminate and poor reliability of adhesion at an interface between different materials are avoided.

Claims

1. A method of fabricating a rigid flexible printed circuit board, comprising the steps of:

preparing a circuit layer, the circuit layer comprising;

a first insulating layer through which a first window is formed;

an internal circuit pattern which is formed on a side of the first insulating layer having the first window; and

first and second protective films for protecting a portion of the internal circuit pattern formed in the first window;

preparing a second insulating layer through which a second window is formed so as to correspond to the first window;

layering a plurality of circuit layers and a plurality of second insulating layers to form a laminate; and

forming external layers, through which third windows are formed so as to correspond to the first and second windows, on upper and lower sides of the laminate, each of the external layers comprising;

an external circuit pattern which corresponds to the internal circuit pattern; and

third and fourth protective films which protect a portion of the external circuit pattern formed in each of the third windows,

wherein a portion corresponding to the first, second, and third windows is a flexible portion.

2. The method as set forth in claim 1, wherein the step of preparing a circuit layer comprises the steps of:

providing the first insulating layer through which the first window is formed;

applying the first protective film on a side of the first insulating layer to cover the first window;

layering a copper foil layer on the other side of the first insulating layer;

forming the internal circuit pattern on the copper foil layer; and

applying the second protective film to protect a portion of the internal circuit pattern formed in the first window in conjunction with the first protective film.

3. The method as set forth in claim 1, wherein the step of preparing a circuit layer comprises the steps of:

applying the first protective film having a predetermined size on a side of the copper foil layer;

layering the first insulating layer, through which the first window that is smaller than the first protective film is formed, on the side of the copper foil layer to expose a portion of the first protective film;

forming the internal circuit pattern on the copper foil layer; and

applying the second protective film on the internal circuit pattern so that the second protective film corresponds to the first protective film and protects the internal circuit pattern.

4. The method as set forth in claim 1, wherein the first insulating layer and the second insulating layer are at least one of a prepreg and a bonding sheet.

5. The method as set forth in claim 1, wherein the first, second, third, and fourth protective films are at least one of a typical film type of coverlay, a liquid type of coverlay, and a dry film type of coverlay.

6. The method as set forth in claim 1, wherein the step of forming external layers comprises the steps of:

layering preliminary external layers on the upper and lower sides of the laminate, each of the preliminary external layers comprising;

a third insulating layer through which the third window having a size and a position that are identical to those of the first window and the second window is formed; and

the third protective film which is formed on the third insulating layer to cover the copper foil layer formed on a side of the third insulating layer and the third window;

forming the external circuit pattern through which a plurality of via holes is formed on the copper foil layer; and

applying the fourth protective film to protect a portion of the external circuit pattern in the third window in conjunction with the third protective film, thereby forming the external layers.

7. The method as set forth in claim 6, wherein forming the plurality of via holes comprises the step of forming through holes and blind via holes.

8. A method of fabricating a rigid flexible printed circuit board, comprising the steps of:

forming first and second internal circuit patterns, which are electrically connected to each other, on both sides of a first insulating layer through which a first window is formed, and applying first, second, third, and fourth protective films, which correspond to the first window, on both sides of the first insulating layer to protect portions of the first and second internal circuit patterns in the first window, thus preparing a circuit layer;

preparing a second insulating layer through which a second window is formed so as to correspond to the first window;

layering a plurality of circuit layers and a plurality of second insulating layers to form a laminate; and

forming external layers, through which third windows are formed so as to correspond to the first and second windows, on upper and lower sides of the laminate, each of the external layers comprising;

an external circuit pattern which corresponds to the first and second internal circuit patterns; and

fifth and sixth protective films which protect a portion of the external circuit pattern formed in each of the third windows,

wherein a portion corresponding to the first, second, and third windows is a flexible portion.

9. The method as set forth in claim 8, wherein the step of forming first and second internal circuit patterns comprises the steps of:

providing the first insulating layer through which the first window is formed;

applying the first protective film and the second protective film on upper and lower sides of the first insulating layer to cover the first window;

layering a copper foil layer on the upper and lower sides of the first insulating layer on which the first protective film and the second protective film are applied;

forming an internal via hole through the copper foil layer, and conducting electroless and electrolytic copper plating processes;

forming the first and second internal circuit patterns on the copper foil layer; and

applying the third protective film and the fourth protective film on the first protective film and the second protective film to protect the first and second internal circuit patterns.

10. The method as set forth in claim 8, wherein the first insulating layer and the second insulating layer are at least one of a prepreg and a bonding sheet.

11. The method as set forth in claim 8, wherein the first, second, third, fourth, fifth, and sixth protective films are at least one of a typical film type of coverlay, a liquid type of coverlay, and a dry film type of coverlay.

12. The method as set forth in claim 8, wherein the step of forming external layers comprises the steps of:

layering preliminary external layers on the upper and lower sides of the laminate, each of the preliminary external layers comprising;

a third insulating layer through which the third window having a size and a position that are identical to those of the first window and the second window is formed; and

the fifth protective film which is formed on the third insulating layer to cover the copper foil layer formed on a side of the third insulating layer and the third window;

forming the external circuit pattern through which a plurality of via holes is formed on the copper foil layer; and

applying the sixth protective film to protect a portion of the external circuit pattern in the third window in conjunction with the fifth protective film, thereby forming the external layers.

13. The method as set forth in claim 12, wherein forming the plurality of via holes comprises the step of forming through holes and blind via holes.