Light-emitting module

• US 7,348,604 B2
• Filed: 05/19/2006
• Issued: 03/25/2008
• Est. Priority Date: 05/20/2005
• Status: Active Grant

• Current Assignee: Signify Holding B.V. (Signify N.V.)
• Original Assignee: TIR Technology LP
• Inventors: Matheson, George E.
• Primary Examiner(s): CLARK, JASMINE JHIHAN B
• Application Number:
  US11/419,292
• Publication Number:
  US 20060284199A1
• Time in Patent Office: 676 Days
• Field of Search: 257/81, 257/83, 257 98-100, 257/116, 257/177, 257431-433, 257678-733, 257E23001-E23194, 257/E25.032
• US Class Current: 257/98
• CPC Class Codes: F21V 15/01 Housings, e.g. material or assembling of housing parts F21V15/02 takes precedence housings forming signs or letters G09F13/04
• CPC Class Codes: F21V 19/003 Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
• CPC Class Codes: F21V 21/002 making direct electrical contact, e.g. by piercing F21V21/35 takes precedence
• CPC Class Codes: F21V 21/08 Devices for easy attachment to any desired place, e.g. clip, clamp, magnet
• CPC Class Codes: F21V 29/74 with fins or blades
• CPC Class Codes: F21V 29/763 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21V 31/04 Provision of filling media
• CPC Class Codes: F21V 5/002 using microoptical elements for redirecting or diffusing light
• CPC Class Codes: F21V 5/045 the lens having discontinuous faces, e.g. Fresnel lenses
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/645 the elements being electrically controlled, e.g. Peltier elements
• CPC Class Codes: H01L 33/648 the elements comprising fluids, e.g. heat-pipes
• CPC Class Codes: H01R 12/675 with contacts having at least a slotted plate for penetration of cable insulation, e.g. insulation displacement contacts for round conductor flat cables
• CPC Class Codes: H01R 13/50 formed as an integral body H01R13/514 takes precedence
• CPC Class Codes: H01R 13/6658 on printed circuit board H01R13/6666 - H01R13/6691 take precedence
• CPC Class Codes: H01R 13/7175 Light emitting diodes (LEDs)
• CPC Class Codes: H01R 25/14 : Rails or bus-bars constructed so that the counterparts can be connected thereto at any point along their length supporting elements for lighting devices, displaceable along guiding elements and making electrical contact with conductors running along the guiding elements F21V21/35
• CPC Class Codes: H10K 50/87 : Arrangements for heating or cooling

Abstract

The light-emitting module according to the present invention comprises a heat dissipation element, a substrate for example a metal core printed circuit board (MCPCB), or FR4 board which is coupled to one or more light-emitting elements and provides a means for operative connection of the light-emitting elements to a source of power. The substrate is positioned such that it is thermally coupled to the heat dissipation element. The light-emitting module further comprises a housing element which matingly connects with the heat dissipation element, wherein the housing element may further comprise an optical element integrated therein for manipulation of the light generated by the one or more light-emitting elements.

Claims

1. A light-emitting module comprising:

(a) a thermally conductive substrate having one or more light-emitting elements thermally connected thereto, the substrate configured to operatively couple a source of power to the one or more light-emitting elements, thereby providing a means for activation of the one or more light-emitting elements;

(b) a heat dissipation element thermally coupled to the thermally conductive substrate; and

(c) a housing element including fastening means for detachably coupling the housing element to the heat dissipation element, said substrate being enclosed between the heat dissipation element and said housing element, said housing element including a transparent region enabling transmission of light emitted by the one or more light-emitting elements therethrough.

2. The light-emitting module according to claim 1 further comprising one or more optical elements for manipulation of the light emitted by said one or more light-emitting elements, said optical element optically coupled to said housing element.

3. The light-emitting module according to claim 2, wherein the one or more optical elements and the housing element are integrally formed.

4. The light-emitting module according to claim 2, wherein the optical element is a reflective element, refractive element, diffractive element, diffusive element or holographic element.

5. The light-emitting module according to claim 4, wherein the optical element is a diffuser, lenticular element, Fresnel array or lens.

6. The light-emitting module according to claim 1, wherein the substrate is configured to operatively couple a source of power to the one or more light-emitting elements using solderless connections.

7. The light-emitting module according to claim 6, wherein the solderless connections are insulation displacement connectors.

8. The light-emitting module according to claim 1, wherein the substrate is a metal core printed circuit board or a FR4 board.

9. The light-emitting module according to claim 1, wherein the substrate includes internal electrical conductive paths.

10. The light-emitting module according to claim 1, wherein the substrate includes circuit traces forming electrical conductive paths.

11. The light-emitting module according to claim 1, wherein the housing element is formed from flexible material for releasably connecting to the heat dissipation element.

12. The light-emitting module according to claim 1, wherein a sealant substance is positioned between the housing element and the heat dissipation element for environmental sealing between the housing element and the heat dissipation element.

13. The light-emitting module according to claim 1, wherein the heat dissipation element is configured for thermal connection to a heat pipe or a thermosyphon.

14. The light-emitting module according to claim 1, wherein the heat dissipation element is configured for thermal connection to a heat dissipation system.

15. The light-emitting module according to claim 14, wherein the heat dissipation system is a forced convection mechanism, electro-cooling mechanism or a low temperature heat bath.