Semiconductor device for high frequency uses and manufacturing method of the same
First Claim
1. A semiconductor device, comprising:
- a semiconductor substrate;
gate electrodes formed above said semiconductor substrate;
a pair of impurity diffusion layers formed in a surface layer of said semiconductor substrate at both sides of each of said gate electrodes;
drift layers formed in the surface layer of said semiconductor substrate between said gate electrodes and one of said impurity diffusion layers as a same conduction type as said impurity diffusion layers; and
a pair of electrodes each electrically connected to the pair of impurity diffusion layers via a barrier metal film,wherein said gate electrodes do not include said barrier metal film, andwherein said gate electrodes have an upper portion extending over a side of a lower portion and made of metal including aluminum and silicon as a material.
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Accused Products
Abstract
The semiconductor device has a semiconductor substrate, gate electrodes formed above the semiconductor substrate, and a pair of impurity diffusion layers formed in a surface layer of the semiconductor substrate at both sides of each of the gate electrodes. The semiconductor device also has drift layers formed in the surface layer of the semiconductor substrate between the gate electrodes and one of the impurity diffusion layers as a same conduction type as the impurity diffusion layers. The gate electrodes are made of metal including aluminum, and each is formed in an overhang shape. The semiconductor device can provide an LDMOS transistor enhanced in maximum transmission frequency and power gain and capable of a high-frequency operation with high efficiency as a basic element of a high-frequency power amplifier.
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Citations
5 Claims
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1. A semiconductor device, comprising:
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a semiconductor substrate; gate electrodes formed above said semiconductor substrate; a pair of impurity diffusion layers formed in a surface layer of said semiconductor substrate at both sides of each of said gate electrodes; drift layers formed in the surface layer of said semiconductor substrate between said gate electrodes and one of said impurity diffusion layers as a same conduction type as said impurity diffusion layers; and a pair of electrodes each electrically connected to the pair of impurity diffusion layers via a barrier metal film, wherein said gate electrodes do not include said barrier metal film, and wherein said gate electrodes have an upper portion extending over a side of a lower portion and made of metal including aluminum and silicon as a material. - View Dependent Claims (2, 3, 4, 5)
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Specification