Electronic part having reinforcing member

• US 7,348,679 B2
• Filed: 10/10/2005
• Issued: 03/25/2008
• Est. Priority Date: 11/24/2004
• Status: Expired due to Fees

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Saimen, Munehide
• Primary Examiner(s): Jackson; Jerome
• Assistant Examiner(s): Valentine; Jami M
• Application Number:
  US11/247,610
• Publication Number:
  US 20060108699A1
• Time in Patent Office: 897 Days
• Field of Search: 257/734, 257774-777
• US Class Current: 257/784
• CPC Class Codes: H01L 23/49572 consisting of thin flexible metallic tape with or without a film carrier H01L23/49503 - H01L23/49568 and H01L23/49575 - H01L23/49579 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/118 specially for flexible printed circuits, e.g. using folded portions
• CPC Class Codes: H05K 2201/09236 Parallel layout
• CPC Class Codes: H05K 2201/09727 Varying width along a single conductor; Conductors or pads having different widths
• CPC Class Codes: H05K 2201/10681 Tape Carrier Package [TCP]; Flexible sheet connector
• CPC Class Codes: H05K 2201/2009 Reinforced areas, e.g. for a specific part of a flexible printed circuit
• CPC Class Codes: H05K 2203/0228 Cutting, sawing, milling or shearing
• CPC Class Codes: H05K 3/0052 Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
• CPC Class Codes: H05K 3/0058 Laminating printed circuit boards onto other substrates, e.g. metallic substrates H05K1/0281 takes precedence

Abstract

A method for manufacturing an electronic part, including: cutting a wiring substrate, which contains a base substrate, a wiring pattern provided on a first surface of the base substrate, and a reinforcing member provided on a second surface of the base substrate, along a line intersecting with an outer circumference of the reinforcing member; wherein a wire, out of a plurality of wires composing the wiring pattern, arranged closest to an intersecting point of the outer circumference of the reinforcing member and the line has a widest width.

Claims

1. An electronic part, comprising:

a base substrate having a crack;

a plurality of wires provided on a first surface of the base substrate; and

a reinforcing member provided on a second surface of the base substrate;

wherein the plurality of wires passes through a part of the first surface overlapping with the reinforcing member; and

the crack is formed such that at least a part of the crack is located at an intersection point between a first line of lines that constitute an outline of the reinforcing member and a circumference of the base substrate.

4. The electronic part of claim 1, wherein the plurality of wires includes a first wire that is arranged closest to the intersection point, and the first wire has a widest width among the plurality of wires.

5. The electronic part of claim 1, wherein the plurality of wires extend from a region of the first surface that does not overlap the reinforcing member to a region of the first surface that overlaps the reinforcing member.

2. An electronic part, comprising:

a base substrate having a crack;

a plurality of wires provided on a first surface of the base substrate; and

a reinforcing member provided on a second surface of the base substrate;

wherein the plurality of wires passes through a part of the first surface overlapping with the reinforcing member;

the crack is formed such that at least a part of the crack is located at an intersection point between a first line of lines that constitute an outline of the base substrate and a circumference of the base substrate;

the plurality of wires includes a first wire that is arranged closest to the intersection point; and

the first wire diverges from one wire of the plurality of wires.

6. The electronic part of claim 2, wherein the plurality of wires extend from a region of the first surface that does not overlap the reinforcing member to a region of the first surface that overlaps the reinforcing member.

3. An electronic part, comprising:

a wiring substrate having a base substrate having a crack;

a plurality of wires provided on a first surface of the base substrate;

a reinforcing member provided on a second surface of the base substrate; and

a semiconductor chip mounted on the wiring substrate;

wherein the plurality of wires passes through a part of the first surface overlapping with the reinforcing member;

the crack is formed such that at least a part of the crack is located at an intersection point between a first line of lines that constitute an outline of the base substrate and a circumference of the base substrate;

the plurality of wires includes a first wire that is arranged closest to the intersecting point; and

the first wire is not electrically connected to the semiconductor chip.

7. The electronic part of claim 3, wherein the plurality of wires extend from a region of the first surface that does not overlap the reinforcing member to a region of the first surface that overlaps the reinforcing member.