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Method and structures for indexing dice

  • US 7,348,682 B2
  • Filed: 04/19/2005
  • Issued: 03/25/2008
  • Est. Priority Date: 04/19/2004
  • Status: Active Grant
First Claim
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1. A die obtained from a material wafer comprising a plurality of stacked material layers, the die being provided with a visible index indicative of a respective die position of the die in the wafer, the visible index includesa reference structure formed in a first material layer of the die and adapted to defining a mapping of the wafer;

  • anda marker formed in a second material layer of the die, associated with the reference structure, and adapted to providing an indication of the respective die position.

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