Ink supply arrangement incorporating sets of passages for carrying respective types of ink

• US 7,350,906 B2
• Filed: 05/15/2007
• Issued: 04/01/2008
• Est. Priority Date: 10/16/1998
• Status: Expired due to Fees

• Current Assignee: Zamtec Limited (Memjet Limited)
• Original Assignee: Silverbrook Research Pty Limited
• Inventors: Silverbrook, Kia
• Primary Examiner(s): JACKSON, JUANITA DIONNE
• Application Number:
  US11/748,490
• Publication Number:
  US 20070211102A1
• Time in Patent Office: 322 Days
• Field of Search: 347/20, 347/54, 347/56, 347 61- 65, 347/67, 347 84- 87, 347/44, 347/47
• US Class Current: 347/84
• CPC Class Codes: B05D 2201/00 Polymeric substrate or laminate
• CPC Class Codes: B05D 3/08 by flames
• CPC Class Codes: B41J 2/04528 aiming at warming up the head
• CPC Class Codes: B41J 2/04541 Specific driving circuit
• CPC Class Codes: B41J 2/04543 Block driving
• CPC Class Codes: B41J 2/04553 detecting ambient temperature
• CPC Class Codes: B41J 2/04563 detecting head temperature; Ink temperature
• CPC Class Codes: B41J 2/04571 detecting viscosity
• CPC Class Codes: B41J 2/04585 controlling heads based on thermal bent actuators
• CPC Class Codes: B41J 2/04588 using a specific waveform
• CPC Class Codes: B41J 2/04591 Width of the driving signal being adjusted
• CPC Class Codes: B41J 2/04596 Non-ejecting pulses
• CPC Class Codes: B41J 2/14 Structure thereof only for on-demand ink jet heads
• CPC Class Codes: B41J 2/14427 Structure of ink jet print heads with thermal bend detached actuators
• CPC Class Codes: B41J 2/1623 bonding and adhesion
• CPC Class Codes: B41J 2/1626 etching
• CPC Class Codes: B41J 2/1628 dry etching
• CPC Class Codes: B41J 2/1629 wet etching
• CPC Class Codes: B41J 2/1631 photolithography
• CPC Class Codes: B41J 2/1632 machining
• CPC Class Codes: B41J 2/1635 : dividing the wafer into individual chips
• CPC Class Codes: B41J 2/1639 : sacrificial molding
• CPC Class Codes: B41J 2/1642 : thin film formation by CVD [chemical vapor deposition]
• CPC Class Codes: B41J 2/1646 : thin film formation by sputtering
• CPC Class Codes: B41J 2/1648 : Production of print heads with thermal bend detached actuators
• CPC Class Codes: B41J 2002/14419 : Manifold
• CPC Class Codes: B41J 2002/14491 : Electrical connection
• CPC Class Codes: Y10T 29/49345 : Catalytic device making

Abstract

An ink supply arrangement is provided for supplying ink to an inkjet printhead. The ink supply arrangement includes an elongate ink distribution molding, in turn, defining a printhead channel in which the printhead can be received. The ink distribution molding further defines sets of passages for supplying respective types of ink to the printhead. A baffle unit is configured to be engaged relative to the ink distribution molding, and defines a plurality of elongate walls and a plurality of baffles extending from the walls. A housing can receive the baffle unit to define a plurality of ink storage chambers in fluid communication with respective sets of passages.

Claims

1. An ink supply arrangement for supplying ink to an inkjet printhead, the ink supply arrangement comprising:

an elongate ink distribution molding defining a printhead channel in which the printhead can be received and sets of passages for supplying respective types of ink to the printhead;

a baffle unit configured to be engaged relative to the ink distribution molding, and defining a plurality of elongate walls and a plurality of baffles extending from the walls; and

a housing which can receive the baffle unit to define a plurality of ink storage chambers in fluid communication with respective sets of passages.

2. An ink supply arrangement as claimed in claim 1, wherein each of said passages tapers inwardly toward the printhead.

3. An ink supply arrangement as claimed in claim 1, including a triplet of said sets and a pair of said elongate walls.

4. An ink supply arrangement as claimed in claim 1, wherein the baffle unit is ultrasonically welded to the housing.

5. An ink supply arrangement as claimed in claim 1, wherein the baffle unit includes a plurality of end wall portions which can be pierced so that ink can be supplied into respective ink storage chambers.

6. An ink supply arrangement as claimed in claim 1, wherein the housing defines a plurality of air holes to allow the ingress of air into the ink storage chambers responsive to the egress of ink from the ink storage chambers.

7. An ink supply arrangement as claimed in claim 1, wherein a filter covers the ink distribution molding and is configured to filter ink supplied thereto.

8. An ink supply arrangement as claimed in claim 7, wherein silicone gel or another like resilient adhesive binds the baffle unit to the filter.