Methods and devices for enhancing bonded substrate yields and regulating temperature

• US 7,351,377 B2
• Filed: 06/18/2001
• Issued: 04/01/2008
• Est. Priority Date: 06/19/2000
• Status: Expired due to Term

• Current Assignee: Caliper Life Sciences Incorporated (Revvity, Inc.)
• Original Assignee: Caliper Life Sciences Incorporated (Revvity, Inc.)
• Inventors: Spaid, Michael R., Louch, Derek, Brooks, Carlton, Bousse, Luc J., Chazan, David
• Primary Examiner(s): Gordon; Brian R.
• Application Number:
  US09/884,429
• Publication Number:
  US 20020025280A1
• Time in Patent Office: 2,479 Days
• Field of Search: 422/99, 422/100, 422/102, 422/58
• US Class Current: 422/502
• CPC Class Codes: B01L 2200/0684 Venting, avoiding backpressure, avoid gas bubbles
• CPC Class Codes: B01L 2200/0689 Sealing
• CPC Class Codes: B01L 2200/12 Specific details about manufacturing devices
• CPC Class Codes: B01L 2300/0816 Cards, e.g. flat sample carriers usually with flow in two horizontal directions
• CPC Class Codes: B01L 2300/0887 Laminated structure
• CPC Class Codes: B01L 2300/1883 using thermal insulation
• CPC Class Codes: B01L 2400/0406 capillary forces
• CPC Class Codes: B01L 2400/0415 electrical forces, e.g. electrokinetic
• CPC Class Codes: B01L 3/502707 characterised by the manufacture of the container or its components by shaping or joining plastic parts B29C59/00, B29C65/00; by laminating B32B37/00; manufacture of microstructural devices in general B81C
• CPC Class Codes: B01L 3/502723 characterised by venting arrangements
• CPC Class Codes: B01L 7/52 with provision for submitting samples to a predetermined sequence of different temperatures, e.g. for treating nucleic acid samples amplification or hybridisation processes per se C12Q1/68; controlling sequential reactions for synthesis B01J19/0046
• CPC Class Codes: B81C 3/001 Bonding of two components

Abstract

Methods and devices that include the use of venting elements for enhancing bonded substrate yields and regulating temperature. Venting elements are generally fabricated proximal to functionalized regions in substrate surfaces to prevent bond voids that form during bonding processes from affecting the functionalized regions. Venting elements generally include venting channels or networks of channels and/or venting cavities.

Claims

1. A fabrication element comprising a body structure that includes two substrates, the body structure having a microchannel network disposed therein and a venting channel disposed therein or at least partially therethrough, the microchannel network disposed within the body structure such that the microchannel network is covered by at least one of the two substrates, the microchannel network comprising a plurality of microchannels, at least two of which microchannels intersect, the venting channel disposed along at least a portion of a side of one or more of the microchannels such that it does not intersect with any microchannel in the microchannel network.

2. The fabrication element of claim 1, wherein the venting channel is disposed substantially parallel to one or more sides of the one or more microchannels in the microchannel network.

3. The fabrication element of claim 1, wherein the fabrication element further comprises a first venting channel network, the venting channel comprising a portion of the first venting channel network.

4. The fabrication element of claim 3, further comprising a second venting channel network, at least one venting channel of which is disposed proximal to a second side of the one or more microchannels in the microchannel network.

5. The fabrication element of claim 4, wherein the venting channel of the first venting channel network and the at least one venting channel of the second venting channel network are disposed substantially parallel to the one or more microchannels in the microchannel network.

6. The fabrication element of claim 4, wherein the venting channel of the first venting channel network and the at least one venting channel of the second venting channel network terminate at least about 0.05 mm from an edge of a port when the one or more microchannels in the microchannel network fluidly communicate with the port.

7. The fabrication element of claim 4, wherein the venting channel of the first venting channel network and the at least one venting channel of the second venting channel network each comprises a width of at least about 5 μ

m.

8. The fabrication element of claim 4, wherein two or more venting channels in the first or second venting channel networks merge in regions where cross-sectional midpoints of the two or more venting channels are separated by at most about 50 μ

m.

9. The fabrication element of claim 4, wherein cross-sectional midpoints of the venting channel of the first venting channel network and the at least one venting channel of the second venting channel network are each disposed at least about 60 μ

m from a cross-sectional midpoint of the one or more microchannels in the at least one microchannel network.

10. The fabrication element of claim 9, wherein the one or more microchannels comprise a width of at least about 60 μ

m.

11. The fabrication element of claim 4, wherein one or more edges of the body structure comprise at least a third venting channel network comprising one or more venting channels.

12. The fabrication element of claim 11, wherein the one or more venting channels comprise widths of at least about 0.1 mm.

13. The fabrication element of claim 11, wherein the one or more venting channels are disposed at least about 3 mm from the one or more edges of the body structure.

14. The fabrication element of claim 11, wherein one or more venting channels of the first and second venting channel networks fluidly communicate with the third venting channel network.

15. A fabrication element comprising a body structure formed by bonding together at least a first and a second substrate, at least one of the first and second substrates having a plurality of components disposed therein, the plurality of components including at least one venting channel network disposed within the body structure at the interface of the first and second substrates to vent bond voids between the bonded substrates, the venting channel network comprising at least two intersecting channels, the venting channel network disposed in at least one of the first and second substrates such that it does not intersect with any other component disposed in the first and second substrates.