Methods and apparatuses for microelectronic assembly having a material with a variable viscosity around a MEMS device

• US 7,352,039 B2
• Filed: 03/24/2005
• Issued: 04/01/2008
• Est. Priority Date: 03/24/2005
• Status: Expired due to Fees

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Garcia, Jason A.
• Primary Examiner(s): Whitehead, Jr.; Carl
• Assistant Examiner(s): Dolan; Jennifer M
• Application Number:
  US11/089,906
• Publication Number:
  US 20060214246A1
• Time in Patent Office: 1,104 Days
• Field of Search: 257/619, 257/E23.119, 257/E23.188, 257/E23.194, 257/E23.128
• US Class Current: 257/415
• CPC Class Codes: B81B 7/0058 for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1461 MEMS

Abstract

Various methods and apparatuses are described in which a micro-electro-mechanical systems (MEMS) device is encapsulated with a material having a variable viscosity with a viscosity value high enough to retard foreign material from contacting the MEMS device during an electronic package assembly process. The material having the variable viscosity may be affixed to a cavity area surrounding the MEMS device prior to an epoxy being dispensed onto the electronic package assembly. The temperature and pressure conditions of the electronic package assembly process may be controlled to ensure when the epoxy is dispensed that the material having the variable viscosity has a high enough viscosity value to retard foreign material from contacting the MEMS device during the electronic package assembly process.

Claims

1. A microelectronic assembly, comprising:

a MEMS substrate;

a MEMS device on the MEMS substrate, the MEMS device having a MEMS component which is movable relative to the MEMS substrate;

a cavity area surrounding the MEMS device at least partially formed by the MEMS substrate; and

a material having a variable viscosity filling the cavity area, wherein the material has a viscosity value high enough to prevent foreign material from contacting the MEMS device during a manufacturing packaging process but later allows the MEMS device to operate freely at a normal operating temperature, wherein the material is one of (i) a bismuth-based alloy solder compound with a melting point equal to or greater than 47°

C. or (ii) a translucent plastic polymer with a melting point above 100°

C. but below 150°

C.

2. The microelectronic assembly of claim 1, wherein the material having a variable viscosity is electrically non-conductive.

3. The microelectronic assembly of claim 1, wherein the cavity area is a hydrophilic region, the material is a hydrophilic compound, and an area surrounding the cavity area is a hydrophobic region to affix the material to the cavity area around the MEMS.

4. The microelectronic assembly of claim 3, wherein the material to affix to the cavity area around the MEMS device is affixed prior to an epoxy being dispensed during the manufacturing packaging process.

5. A computer readable medium containing instructions to cause a machine to create the microelectronic assembly of claim 1.

6. A microelectronic assembly, comprising:

a MEMS substrate with a channel formed in the MEMS substrate;

a MEMS device on the MEMS substrate; and

a cavity area surrounding the MEMS device at least partially formed by the MEMS substrate; and

a material having a variable viscosity filling the cavity area, wherein the material has a viscosity value high enough to prevent foreign material from contacting the MEMS device during an electronic package assembly process, wherein the material having the variable viscosity is adapted to affix to the cavity area around the MEMS device prior to an epoxy being dispensed during the electronic package assembly process and the channel is adapted to remove the material after the epoxy has cured, wherein the material is one of (i) a tin-based solder compound with a melting point equal to or greater than 135°

C. or (ii) a translucent plastic polymer with a melting point above 100°

C.

7. The microelectronic assembly of claim 6, wherein the material is affixed to the cavity area by creating a mechanical bond between the material having the variable viscosity and the cavity area.

8. The microelectronic assembly of claim 6, wherein the MEMS device is an optical device.

9. The microelectronic assembly of claim 6, wherein the material that has the variable viscosity value is a hydrophilic compound and a thin film creates a hydrophilic surface in the cavity area.

10. A computer readable medium containing instructions to cause a machine to create the microelectronic assembly of claim 6.