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Microelectromechanical systems having trench isolated contacts, and methods for fabricating same

  • US 7,352,040 B2
  • Filed: 03/11/2005
  • Issued: 04/01/2008
  • Est. Priority Date: 06/04/2003
  • Status: Active Grant
First Claim
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1. A microelectromechanical device comprising:

  • a chamber;

    a mechanical structure, wherein at least a portion of the mechanical structure is disposed in the chamber;

    a first encapsulation layer having at least one vent formed therein, wherein the first encapsulation layer is at least a portion of a wall of the chamber;

    a second encapsulation layer, deposited over or in the at least one vent to seal the chamber, wherein the second encapsulation layer is a semiconductor material;

    an insulation layer disposed on the second encapsulation layer;

    a contact; and

    a trench, disposed around at least a portion of the contact which is disposed outside the chamber, wherein the trench includes an insulating material disposed therein to electrically isolate the contact.

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